Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days |
| Packaging Details | Vacuum |
| Number of Layers | 6 |
| Glass Epoxy | FR-4, ITEQ IT-140 TG>135, RO4350B 10mil |
| Final height of PCB | 1.8mm ±0.16 |
| Final foil external | 1.0 oz |
| Final foil internal | 1.0 oz |
| Surface Finish | Immersion Gold (12.7%) 2µ" over 100µ" nickel |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0081-V1.0 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days | Packaging Details | Vacuum |
| Number of Layers | 6 | Glass Epoxy | FR-4, ITEQ IT-140 TG>135, RO4350B 10mil |
| Final height of PCB | 1.8mm ±0.16 | Final foil external | 1.0 oz |
| Final foil internal | 1.0 oz | Surface Finish | Immersion Gold (12.7%) 2µ" over 100µ" nickel |
| Solder Mask Color | Green | Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0081-V1.0 | Certification | UL |
| Place of Origin | China |
RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Warm greetings!
Today we’re talking about 6-layer hybrid PCB built on RO4350B and FR-4. Let’s see first one.
It’s for the application of radar antenna. Two cores of RO4350B on top side and bottom side, plated through holes connect each layer. Viewing from the stack-up, each dielectric material is more than 0.2mmm thick which result in whole PCB thickness to 1.9mm thick. Pads and holes are immersion gold plated. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.
Let’s see second one.
This type is more complex than the first one. The 10mil RO4350B core is the same. The main difference is that it contains 3 types blind via. The specifications are as follows:
Base material: RO4350B 10mil + FR4
Layer count: 6 layers
Type: Blind via L1-L2, L1-L3, L1-L4
Format: 82mm x 95mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: No
Final PCB height: 1.4 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months
There’s a very similar products whose inner-layers are using half ounce copper. Finished PCB thickness is 1.0mm. Following is the stack-up and microsecton.
There’re many advantages of RO4350B hybrid PCBs.
1) Signal integrity performance improved over the stack-ups with all FR4 board;
2) Cost reduced over stack-ups with all low loss material;
3) Engineering design prevents problems from occurring in pre-production;
4) ISO9000, ISO14001, IATF16949, UL Certified factory
5) IPC Class 2 / IPC Class 3;
The applications are wide, listed below: Radar data acquisition converter, miscrostrip antenna, tower-mounted booster, modular oscilloscope, attenuator and 5G antenna etc.
Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.
Appendix: PCB Data Sheet
| PCB SIZE | 75 x 110mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 6 Layers |
| Surface Mount Components | YES |
| Through Hole Components | No |
| LAYER STACKUP | Copper ------- 35um(1 oz)+plate TOP layer |
| Dielectric RO4350B 0.254mm (10 mil) | |
| Copper ------- 35um(1oz) | |
| PP+FR4+PP 0.695mm | |
| Copper ------ 35um (1oz) | |
| FR-4 0.25mm | |
| Copper ------ 35um (1oz) | |
| PP 0.21mm | |
| Copper ------35um (1oz) | |
| Dielectric RO4350B 0.254mm (10 mil) | |
| Copper ------- 35um(1 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 5 mil |
| Minimum / Maximum Holes: | 0.3 mm / 2.0 mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 167 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 3 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B Tg280℃, er<3.48, Rogers Corp. FR-4 IT158 |
| Final foil external: | 1.5 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.8 mm ±0.18mm |
| PLATING AND COATING | |
| Surface Finish | Immersion gold |
| Solder Mask Apply To: | TOP, 12micron Minimum |
| Solder Mask Color: | Green, PRS-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.3mm. Blind via L1-L2, L3-L6 |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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