Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 3 |
| Glass Epoxy | RO4350B+ RT/duroid 5880 |
| Final foil | 1.0 |
| Final height of PCB | 1.8 mm ±10% |
| Surface Finish | Immersion gold |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0073-V1.12 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 3 | Glass Epoxy | RO4350B+ RT/duroid 5880 |
| Final foil | 1.0 | Final height of PCB | 1.8 mm ±10% |
| Surface Finish | Immersion gold | Solder Mask Color | Green |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-0073-V1.12 |
| Certification | UL | Place of Origin | China |
Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Warm greetings!
The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.
Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.
This is a 3-layer board that one layer is etched off.
The basic specifications are as follows:
Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)
Dielectric constant: 3.48+/-0.05
Layer count: 3 layers
Via type: Through holes, blind vias
Format: 160mm x 90mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm | Inner layer 35μm
Solder mask / Legend: Green / White
Final PCB height: 1.3 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months
Features and benefits
1) Lowest electrical loss for reinforeced PTFE material
2) Enhanced electrical performance;
3) 16000 square meter workshop;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 17 years of PCB experience;
Applications
Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module
Properties of RT/duroid 5880
| RT/duroid 5880 Typical Value | ||||||
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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