Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Glass Epoxy | RF-35TC |
| Final foil | 2 Oz |
| Final height of PCB | 0.8 mm ±10% |
| Surface Finish | Immersion gold |
| Solder Mask Color | Black |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-104-V0.61 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Glass Epoxy | RF-35TC |
| Final foil | 2 Oz | Final height of PCB | 0.8 mm ±10% |
| Surface Finish | Immersion gold | Solder Mask Color | Black |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-104-V0.61 |
| Certification | UL | Place of Origin | China |
Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver and Immersion Tin
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we introduce high frequency PCB built on RF-35TC.
RF-35TC is a PTFE based, ceramic filled fiberglass high frequency material from Taconic company.
First, take a look at some of its advantages:
Exceptional thermal management
This material offers superior heat dissipation performance, so it's a type of thermally conductive low loss laminate. It's best suited for high power applications. Heat dissipates away from both transmission line on PCB and surface mount components such as capacitor etc.
Similarly, Dk stability is across a broad temperature range; antenna gains and efficiencies are enhanced, RF-35TC bonds very well to Low Profile copper, reducing insertion loss.
Going back to the table, let’s take a look at its main applications:
1. Power amplifiers: The extremely low Df of 0.0011 and high thermal conductivity are particular suited for power amplifier applications.
2. Couplers: The Low Z axis CTE and temperature stable Dk are critical for both narrow and broad band overlay couplers.
3. Filters: The low X and Y CTE values are crucial for maintaining critical distances between trace elements in a printed filter
In addition, It’s also widely used in antennas, satellite equipment and so on. Next, let’s take a look at our PCB capabilities.
Our PCB Capability (RF-35TC)
| PCB Material: | PTFE based ceramic filled fiberglass substrate | |
| Designator: | RF-35TC | |
| Dielectric constant @ 10GHz: | 3.50 | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type | |
| Copper weight: | 0.5oz, 1oz, 2oz | |
| PCB thickness: | 0.3mm, 0.6mm, 0.8mm, 1.6mm | |
| (10mil, 20mil, 30mil, 60mil substrate) | ||
| Solder mask: | Green, Red, Black, White, Blue etc. | |
| PCB size: | ≤400mm X 500mm | |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. | |
At present, our company can provide single sided PCB, double sided PCB, multi-layer PCB and hybrid PCB.
The copper thickness is mainly 1oz and 2oz.
According to different uses, there are many kinds of thickness to choose from, such as 0.3mm, 0.6mm, 0.8mm and 1.6mm.
The color of solder mask is available in green, red, black, white and blue etc.
Our maximum PCB size is within 400X 500mm.
A variety of surface finishes are available, such as bare copper, Hot air level, immersion gold and immersion tin .
The basic colour of RF-35TC PCB is brown and grey.
Our company focuses on prototypes, small batch and mass production. Should you have any questions, please feel free to contact us.
Thank you for reading.
Appendix: Data Sheet RF-35TC
| RF-35TC TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
| Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
| Df @10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
| Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
| Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
| Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
| Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
| Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
| Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
| Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
| Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
| Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
| Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
| Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
| Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
| Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
| Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
| Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
| Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
| Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
| Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
| Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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