Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T,Paypal |
| Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY |
| Packaging Details | VACUUM |
| Board Material | PI, PET |
| Board Thickness | 0.03mm-3.0mm |
| Surface/Inner layer Cu thickness | 0.5oz, 1oz, 2oz |
| Surface Finish | Immersion Gold, Immersion Sliver, Immersion Tin |
| Coverlay Colour | Yellow, White, Black, Green |
| Color of Silkscreen | Yellow, White, Black, Green |
| Function | 100% Pass electrical test |
| Number of Layers | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0339-V3.39 |
| Certification | UL |
| Place of Origin | CHINA |
View Detail Information
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Product Specification
| Payment Terms | T/T,Paypal | Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY | Packaging Details | VACUUM |
| Board Material | PI, PET | Board Thickness | 0.03mm-3.0mm |
| Surface/Inner layer Cu thickness | 0.5oz, 1oz, 2oz | Surface Finish | Immersion Gold, Immersion Sliver, Immersion Tin |
| Coverlay Colour | Yellow, White, Black, Green | Color of Silkscreen | Yellow, White, Black, Green |
| Function | 100% Pass electrical test | Number of Layers | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0339-V3.39 |
| Certification | UL | Place of Origin | CHINA |
FPC Assembly for Mobile Device and Computer Equipment
Overview
A breakdown of a flexible circuit shows that it consists of 3 basic elements: copper foil, dielectric material and adhesive. Most of the manufacturing processes, i.e. imaging transfer, plating and etching, are quite similar to those used when producing plated-through boards. However, there're differences due to the thin and floppy material used in flexible circuits.
| Bicheng Flexible Printed Circuit Capability 2019 | ||
| No. | Specifications | Capabilities |
| 1 | Board Type | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| 2 | Base Material | PI, PET |
| 3 | Copper Weight | 0.5oz, 1oz, 2oz |
| 4 | LED Maximum Size | 250 x 5000mm |
| 5 | General Maximum Size | 250 x 2000mm |
| 6 | Board Thickness | 0.03mm-3.0mm |
| 7 | Thickness Tolerance | ±0.03mm |
| 8 | Mininum Drill Hole | 0.05mm |
| 9 | Maximum Drill Hole | 6.5mm |
| 10 | Tolerance of Drill Hole | ±0.025mm |
| 11 | Thickness of Hole Wall | ≧ 8 um |
| 12 | Minimum Track/Gap of Single Layer Board | 0.025/0.03mm |
| 13 | Minimum Track/Gap of Double Layer and Multilayer Board | 0.03/0.040mm |
| 14 | Etching Tolerance | ±0.02mm |
| 15 | Minimum Width of Silk Legend | ≧ 0.125mm |
| 16 | Minimum Heigh of Silk Legend | ≧0.75mm |
| 17 | Distance from Legend to Pad | ≧0.15mm |
| 18 | Distance from Opening Solder Mask of Drill Coverlay to Track | ≧0.03mm |
| 19 | Distance from Opening Solder Mask of Punching Coverlay to Track | ≧0.03mm |
| 20 | Thickness of Immersion Nickel | 100-300u" |
| 21 | Thickness of Immersion Gold | 1-3u" |
| 22 | Thicnkess of Immersion Tin | 150-400u" |
| 23 | Minimum Electrical Testing Pad | 0.2mm |
| 24 | Minimum Tolerance of Outline(Normal Steel Mould Punch) | ±0.1mm |
| 25 | Minimum Tolerance of Outline (Precision Steel Mould Punch) | ±0.05mm |
| 26 | Mininum Radius of Bevel Angle (Outline) | 0.2mm |
| 27 | Stiffner Material | PI, FR-4, 3M Adhesive, PET, Steel Sheet |
| 28 | RoHs | Yes |
| 29 | Solder Mask Colour | Yellow, White, Black, Green |
Purpose of Flexible Circuits
1) To provide interconnections between printed circuit boards and other components.
2) To serve as three-dimensional substrates for the mounting of SMT components, e.g., in
photographic and video cameras.
3) To establish interconnections capable of withstanding dynamic flexing.
4) To form part of rigid-flex circuit boards.
Advantages
1) Flexibility
2) Volume decreases
3) Weight reduces
4) Consistency of SMD mounting
5) Reliability increases
6) Controllability of electrical design of parameters
7) Tin soldered overall on the FPC end
8) Material optional (PI, PET)
9) Low cost
10) Continuity of processing
Applications
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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