China Chips Star Semiconductor Co., Ltd.
| Payment Terms | L/C, T/T |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Capacity | 8GB-256GB |
| Agreement | HS400 |
| Read speed | Up to 330MB/s |
| Write speed | Up to 240MB/s |
| Operating temperature | -40℃~+85℃/-45℃~+105℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Interface | eMMC5.1 |
| Package Type | FBGA |
| Brand Name | PG |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, T/T | Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days | Capacity | 8GB-256GB |
| Agreement | HS400 | Read speed | Up to 330MB/s |
| Write speed | Up to 240MB/s | Operating temperature | -40℃~+85℃/-45℃~+105℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND | Interface | eMMC5.1 |
| Package Type | FBGA | Brand Name | PG |
| Place of Origin | China | ||
| High Light | Large Capacity eMMC5.1 ，eMMC5.1 512GB | ||
| Model | G2564GTLIA | G25128TLIA | G25256TLIA | G25512TLIA |
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating temperature |
-40℃~85℃/-45℃~105℃
|
-40℃~85℃/-45℃~105℃
|
-40℃~85℃/-45℃~105℃
|
-40℃~85℃/-45℃~105℃
|
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
High reliability: Compared to consumer EMMCs, industrial and automotive EMMCs have higher stability and durability, and can provide stable performance under long, high-intensity working conditions, especially for applications requiring high availability.
Wide temperature range adaptability: eMMC and eMMC support a wider temperature range, enabling them to adapt to industrial equipment, automotive electronics, medical equipment and other temperature-demanding environments, ensuring stable operation of the system under extreme temperature conditions.
Data protection and security: eMMC's built-in ECC and power failure protection greatly improve data security and integrity, avoiding data damage or loss, especially for critical applications such as automotive control systems, industrial control systems, etc.
Seismic and vibration resistance: Due to the need to deal with strong vibrations and shocks, eMMC especially emphasizes shock resistance to ensure the stability of the vehicle during driving, which is suitable for on-board navigation, on-board entertainment systems, etc.
High load resistance and long running time: Gauge and vehicle gauge eMMC has high write durability and can operate stably for a long time under high write operation, suitable for 24/7 continuous operation of industrial equipment and on-board systems.
Applicable to a wide range of industries: industrial and vehicle regulations eMMC is not only suitable for industrial automation, automotive electronics, but also widely used in medical equipment, embedded systems, intelligent hardware and other fields to meet the needs of these industries for high reliability and high stability.
Low power and space optimization: eMMC's low-power design helps extend battery life, while its compact size enables it to be used in devices with limited space, making it ideal for on-board and embedded applications.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
50~100
Ecer Certification：
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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