Products
Manufacturer of a wide range of products which include 1.5mm Rigid Flex PCB Green Cover Film White 10 Layer PCB ENIG,2oz Rigid Flex PCB 8 Layer ENIG Green Cover Film White 1.5mm,Rigid High Density Interconnect Boards 4L / HDI Mult...
MOQ: Negotiable
Price: Negotiable
Layers | 10L |
Material | FR4+Flex |
Solder Mask | Green+Cover Film |
Silkscreen | White |
Surface Finish | ENIG |
Finished copper | 2oz |
Board thickness | 1.5mm |
Dimension | 30*123.42mm |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Layers | 8L |
Material | FR4+Flex |
Solder Mask | Green+Cover Film |
Silkscreen | White |
Finished copper | 2oz |
Board thickness | 1.5mm |
Dimension | 120.2*47.17mm |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Layer count: | 4L / Multilayer |
Copper thickness: | 2/3/3/2 OZ |
Board thickness: | 1.6MM+/-10% |
Min hole size: | 0.30mm |
Aspect ratio: | 5.33:1 |
Name | High Density Interconnect PCB Boards |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Layers | 16L |
Material | S1000-2M |
Solder Mask | green |
board size | 124*101mm |
Finished copper | 1oz |
Board thickness | 1.83mm |
MICROVIAS | 1-2,10-16,12-16,14-16 |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Base Material | FR4 / aluminum / ceramic CEM-1 |
Board Thickness | 1.6mm |
Copper Thickness | 1/2oz, 1oz, 2oz, 3oz |
Surface Finishing | OSP |
Min. Line Width | 3mil |
Min. Hole Size | 0.20mm |
Min. Line Spacing | 0.003″ |
Solder mask color | White, Black, Yellow, Green, Red, Blue |
Surface Finish | HASL |
Testing | 100% AOI Testing |
Certificate | ISO, UL, SGS and ROHS |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
material | FR4 EM825 |
layer count | Multilayer |
Surface finishing | ENIG |
Board thickness | 1.0mm |
Min. hole size | 0.1mm |
Application | automotive |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Base Material | FR4, CEM-1 |
Board Thickness | 1.6mm |
Copper Thickness | 1oz |
Surface Finishing | HASL, ENIG, OSP |
Min. Line Width | 3mil |
Min. Hole Size | 0.2mm |
Min. Line Spacing | 3mil |
Solder mask color | Black, red, blue, yellow, green |
PCB Standard | IPC-A-610 D / IPC-III Standard |
Impedence Control Tolerance | ±5% |
Certificate | ISO, UL, SGS and ROHS |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
material | FR4 |
layer count | 8 |
Surface finishing | ENIG |
Application | Security |
Board thickness | 1+/-0.1mm |
min.hole size | 0.2mm |
Min. line width | 0.104mm |
Min. line spacing | 0.098mm |
Name | Printed Circuit Boards |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
material | FR4 |
layer count | 10 |
Surface finishing | LF HASL |
Application | Industrial Control |
Board thickness | 1.60 |
Min. line width | 0.075mm |
Min. line spacing | 0.075mm |
min.hole size | 0.1mm |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
Layers | 1-48 layers |
Base Material | FR4, CEM1, CEM3, Hight TG |
Board Thickness | 0.1 to 6.0mm (4 to 240mil) |
Copper Thickness | 1oz |
Surface Finishing | HASL |
Min. Line Width | 3mil |
Min. Hole Size | 0.25mm |
Min. Line Spacing | 0.1mm (4mil) |
Solder mask color | Red, Blue, Green, Black, White |
Testing | X-ray Inspection;AOI (Automated Optical Inspection);ICT (In-Circuit Test) / Functional Testing; |
Certificate | ISO, UL, SGS and ROHS |
Packaging Details | Vaccum package |
Delivery Time | Negotiable |
Payment Terms | T/T |
Place of Origin | China |
Brand Name | Customized |
Certification | UL,ISO9001 |
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