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China factory - Foisontech Corporation Co., Limited

Foisontech Corporation Co., Limited

  • China,Shenzhen ,Guangdong
  • Active Member

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HDI PCB Board

Manufacturer of a wide range of products which include High TG PCB Double Sided Printed Circuit Board 1 Oz / 35 µM Copper Thickness,1.6 MM Fr4 High TG170 PCB Board, Security Lcd Display PCB Practice Board, 1oz,HDI PCB Board 10 La...

Quality High TG PCB Double Sided Printed Circuit Board 1 Oz / 35 µM Copper Thickness for sale

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High TG PCB Double Sided Printed Circuit Board 1 Oz / 35 µM Copper Thickness

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 2 Layer
Board Thickness 1.6MM
Copper Thickness 1 Oz / 35 µm
Surface Treatment OSP
Solder Mask Green
Board Size 145* 90 Mm
Min. Aperture 0.4MM
Min. Line Trace Width/Space 0.15 / 0.13 MM
Brand Name FOISON
Model Number FSD0002L0888
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Quality 1.6 MM Fr4 High TG170 PCB Board, Security Lcd Display PCB Practice Board, 1oz for sale

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1.6 MM Fr4 High TG170 PCB Board, Security Lcd Display PCB Practice Board, 1oz

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 2 Layer
Board Thickness 1.6MM
Copper Thickness 1 Oz / 35 µm
Surface Treatment OSP
Solder Mask Green
Board Size 193 * 183.5mm
Min. Aperture 0.25MM
Min. Line Trace Width/Space 0.1 / 0.1 MM
Brand Name FOISON
Model Number FSD0002L0888
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Quality HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated for sale

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HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 10 Layer
Board Thickness 1.6MM
Copper Thickness 1 Oz / 35 µm
Surface Treatment Immersion Gold
Solder Mask Green
Board Size 60 * 52 Mm
Min. Aperture 0.4MM
Min. Line Trace Width/Space 0.15 / 0.15 MM
Brand Name FOISON
Model Number FSD0002L0888
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Quality Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 20 Layer Board for sale

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Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 20 Layer Board

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 20 Layer
Board Thickness 1.6MM
Copper Thickness 1 Oz / 35 µm
Surface Treatment Immersion Gold
Solder Mask Green
Board Size 300 * 210 Mm
Min. Aperture 3Mil
Min. Line Trace Width/Space 0.15 / 0.15 MM
Brand Name FOISON
Model Number FSD0002L06666
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Quality 6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board for sale

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6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 6 Layer
Board Thickness 1.6MM
Copper Thickness 18 µm
Surface Treatment OSP
Solder Mask Green
Board Size 73 * 64 Mm
Min. Aperture 0.5MM
Min. Line Trace Width/Space 3Mil / 3Mil
Brand Name FOISON
Model Number FSD0002L06666
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Quality HDI Multilayered PCB 6-Layer Board, GPS PCB Board & GPS Board Assembly, 18um Copper Thickness for sale

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HDI Multilayered PCB 6-Layer Board, GPS PCB Board & GPS Board Assembly, 18um Copper Thickness

  1. MOQ: 1

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T, Western Union, L/C
Supply Ability 300, 000 sqm Per Month
Delivery Time 5-8 working days
Packaging Details INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Raw Material Fr - 4
Layer Count 6 Layer
Board Thickness 1.6MM
Copper Thickness 18 µm
Surface Treatment ENIG
Solder Mask Green
Board Size 56 * 47 Mm
Min. Aperture 0.5MM
Min. Line Trace Width/Space 5Mil / 5Mil
Brand Name FOISON
Model Number FSD0002L06666
Certification ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin Shenzhen,China

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Get in touch with us

  • Reach Us
  • Foisontech Corporation Co., Limited
  • 3rd Building,Xinwuyuan Industrial Park, Difu Road,Gushu,Xixiang,Bao'an District,Shenzhen,China.
  • http://foisonpcb-com.ecer.com/

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