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Shenzhen Xinchenger Electronic Co.,Ltd

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China High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2
China High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

  1. China High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

  1. MOQ: MOQ 1 Piece
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, Western Union
Supply Ability 1000000 pieces per week
Delivery Time 5-10 working days
Packaging Details 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color Yellow
Material Rogers Material
Layer 4
Board Size 5*9cm
Copper Thinknes 1 oz
Min Line Width 4 mil
Min Line Space 4mil
Surface Finish Immersion Gold
Name Rogers pcb
Brand Name XCE
Model Number XCE BK45
Certification CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union Supply Ability 1000000 pieces per week
Delivery Time 5-10 working days Packaging Details 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color Yellow Material Rogers Material
Layer 4 Board Size 5*9cm
Copper Thinknes 1 oz Min Line Width 4 mil
Min Line Space 4mil Surface Finish Immersion Gold
Name Rogers pcb Brand Name XCE
Model Number XCE BK45 Certification CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin China
High Light Pcb Board PrototypePrinting Circuit Boards

 

High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

 

 

Quick Detail :
1. Type : Pcb
2. Material : Rogers 
3. Layer : 4
4. Products Size :5*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold  
 
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .
 

 

 

Parameter:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

 

 
Description :

RO3203™, RO3206™ and RO3210™ Laminates

RO3203™ , RO3206™ and RO3210™ high frequency circuit materials are ceramic- fi lled laminates reinforced with woven fi berglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability.

The dielectric constant of RO3203 high frequency circuit materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz. The dielectric constant for RO3206 laminate is 6.15 and 10.2 for RO3210 laminate. The dissipation factor for RO3206 and RO3210 laminates is 0.0027.


High Thermal Performance

  • Tg of 200 (DSC), 230°C (DMA)

  • Low CTE for reliability

  • Lead-free Compatible & Rhos Complaint

  • UV Blocking and AOI Fluorescence

  • Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

 
 
PrePreg Material
 It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Key Benefits:

  • High frequency performance (RO3203™ laminate) can be used in applications exceeding 20 GHz
  • Suitable for use with epoxy multi-layer board hybrid designs
  • Surface smoothness allows for finer line etching tolerances

Typical Applications:

  • High frequency performance (RO3203™ laminate) can be used in applications exceeding 20 GHz
  • Suitable for use with epoxy multi-layer board hybrid designs
  • Surface smoothness allows for finer line etching tolerances
  • Typical Applications

  • Automotive collision avoidance systems
  • Automotive global positions satellite antennas
  • Wireless telecommunications systems
  • Microstrip patch antennas for wireless communications
  • Direct broadcast satellites
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure

 

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

  


 
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2002

  • Total Annual:

    1000000-2000000

  • Employee Number:

    100~200

  • Ecer Certification:

    Site Member

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.   We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.   We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...

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Get in touch with us

  • Reach Us
  • Shenzhen Xinchenger Electronic Co.,Ltd
  • Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
  • https://www.fr4-pcb.com/

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