Payment Terms | Western Union,, T/T |
Supply Ability | 1000000PCS/per week |
Delivery Time | 3-12 days |
Packaging Details | Inner:Vacuum packed bubble bag Outer:Carton box / mentioned is standard packing method,unless otherwise specified. |
Material | FR4 PCB |
Color | GREEN |
Size | 18*15cm |
Surface | ENIG |
Board THK | 1.6mm |
Copper THK | 1.5OZ inner 2OZ outer |
Layer | 4 |
Core | 2pcs |
Panel | 1*1 |
Delivery time | 3-7days |
Brand Name | XCEPCB |
Model Number | XCEPCBR |
Certification | CE,FCC,ISO9008,SGS,UL |
Place of Origin | CHINA |
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Product Specification
Payment Terms | Western Union,, T/T | Supply Ability | 1000000PCS/per week |
Delivery Time | 3-12 days | Packaging Details | Inner:Vacuum packed bubble bag Outer:Carton box / mentioned is standard packing method,unless otherwise specified. |
Material | FR4 PCB | Color | GREEN |
Size | 18*15cm | Surface | ENIG |
Board THK | 1.6mm | Copper THK | 1.5OZ inner 2OZ outer |
Layer | 4 | Core | 2pcs |
Panel | 1*1 | Delivery time | 3-7days |
Brand Name | XCEPCB | Model Number | XCEPCBR |
Certification | CE,FCC,ISO9008,SGS,UL | Place of Origin | CHINA |
High Light | multi layered pcb ,multilayer pcb fabrication |
6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave
Capability | Standard | Advanced |
Minimum Layer Count | 1 | 1 |
Maximum Layer Count | 12 | 40 |
Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core | |
Board Thickness | 0.020"-0.125" | 0.005"-0.250" |
Maximum Board Size | 16" x 22" 12" x 21" 22" x 28" | 10" x 16" 16" x 22" 12" x 21" 22" x 28" |
Copper Thickness | 0.5 oz – 3 oz | 0.25 oz – 12 oz |
Minimum Trace Width / Spacing | 0.004"/0.004" | 0.003"/0.003" |
Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
Minimum Hole Size | 0.008" | 0.004" |
Finished Hole Size Tolerance | +/-0.003" | +/-0.002" |
PCB Surface Finish | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG, HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold | |
IPC Class | Class 2 | Class 3 |
Controlled Impedance Tolerance | +/-10 % | +/-5 % |
Blind Vias | Yes | Yes |
Buried Vias | Yes | Yes |
Aspect Ratio | 8/1 | 15/1 |
Minimum Core Thickness | 0.004" | 0.002" |
Carbon Ink | Yes | Yes |
Peelable Mask | Yes | Yes |
Solder Sample | Yes | Yes |
First Article | Yes | Yes |
ISO 9001: 2008 | Yes | Yes |
ISO/TS16949: 2009 | Yes | Yes |
UL 94v0 | Yes |
Specification:
Files:Gerber,protel,powerpcb,Autocad,etc.
Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum
Layer count:1-24 layers
Max.Panel Size:450*1500mm
Board Thickness:0.2-5mm
Min. Core Thickness:0.075mm
Cu Thickness:12-140um
Min. Drill Size:0.2mm
Max. Aspect Ratio: 8:1
Min. Trace Width: 0.1mm
Min line spacing:0.075mm
Min. SMT/QFP Pitch:0.4mm
v Fast PCB Fabrication for Samples and Mass Production
v Electronic Components Sourcing Services
v PCBA Assembly Services:SMT,DIP,BGA...
v Function Test
v Stencil,Cable and Enclosure Assembly
v Reverse engineering service
v Standard Packing and On time Delivery
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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