XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
| Payment Terms | T/T |
| Supply Ability | 10,000 wafers/month |
| Delivery Time | 20-25 working days |
| Brand Name | PAM-XIAMEN |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10,000 wafers/month |
| Delivery Time | 20-25 working days | Brand Name | PAM-XIAMEN |
| Place of Origin | China | ||
| High Light | borosilicate glass wafer ，ultra thin wafer | ||
Borosilicate Lid glass wafer with ultra thin thickness for fiber optic AWG application
Glass Wafer
We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.
| Parameter | Measurement |
| Diameter | 2″, 4″, 6″, 8″, 10″ |
| Dimensional Tolerance | ±0.02μm |
| Thickness | 0.12mm, 0.13mm, 0.2mm, 0.25mm, 0.45mm |
| Thickness Tolerance | ±10μm |
| Thickness Variation (TTV) | < 0.01mm |
| Flatness | 1/10 Wave/Inch |
| Surface Roughness (RMS) | <1.5nm |
| Scratch and Dig | 5/2 |
| Particle Size | <5μm |
| Bow/Warp | <10μm |
| For the customized dimension, please contact us | |
Glass Wafer Process
Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn
Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.
Wafer Lapping: the wafer is lapped to appointed thickness.
Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.
Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.
Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.
Wafer Packaging: All wafers are packed in the single wafer containers.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
1990
Total Annual:
10 Million-50 Million
Employee Number:
50~100
Ecer Certification：
Active Member
Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai... Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...
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