Thermal Conductive Encapsulant Potting Material For Electronics

Product Specification

SLF385 Two Component Potting Compound Silicone Thermal Conductive Encapsulant For Electornic Applications

Company Profiles

Guangzhou Baiyun Chemical Industry Co., Ltd. was established in 1985, which is the first silicone sealant research and production company in China. During this 36 years history, we always provide excellent silicone sealant solutions and service to our customers.

SLF385 Silicone Encapsulant

DESCRIPTION SLF385 silicone 1 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are throughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electornic applications.

KEY FEATURES

◆ Low viscosity and good flowability for fast processing

◆ Good thermal conductivity

◆ Room temperature curing and accelerated cured by heat

◆ UL 94 V0 certified

APPLICATIONS

◆ Power modules,inverters,ballasts,adaptors

◆ Electric control units and sensors

◆ LED lightings

◆ Other electric units product

TYPICAL PROPERTIES

APPLICATION METHODS

PREPARING

Before mixing, Part A and Part B should be agitated well to obtain uniform elastomer. Care should be taken to minimize air entrapment.

MIXING

Thoroughly mix Part A and Part B in a ratio of 1:1 by weight. The liquid mixture should have a uniform appearance. The presence of light-colored streaks of marbling indicates inadequate mixing and will result in incomplete cure. It can be automated mixing or manual mixing.

DEFOAMING

When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids.

CURING

Cure reaction begins with the mixing process. Initially, the mixture of Part A and Part B can be poured/dispensed directly into the container in which it is to be cured. Cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is sensitive to environmental temperature.

COMPATIBILITY

Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of SLF385 silicone encapsulant. Most notable of these include:

• Organotin and other organometallic compounds
• Silicone rubber containing organotin catalyst
• Sulfur, polysulfides, polysulfones or other sulfurcontaining materials
• Amines, urethanes or amine-containing materials
• Unsaturated hydrocarbon plasticizers
• Some solder flux residues

If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

REPAIRABILITY

SLF385 silicone encapsulant can be selectively removed with relative ease, any repairs or changes accomplished, and the repaired area repotted in place with additional product.

PACKING INFORMATION

SLF385 silicone 1:1 mix ratio encapsulants are available in 25kg/25kg plastic tub by set.

USABLE LIFE AND STORAGE

When stored at or below 27℃ in the original unopened containers, this product has a usable life of 9 months from the date of production.

HANDLING AND SAFETY

PRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE FROM BAIYUN SALES APPLICATION ENGINEER, OR DISTRIBUTOR, OR BY CALLING BAIYUN CUSTOMER SERVICE.

The values in this document are not of all specifications and are subject to change without notice. As the actual situation is very different, it’s hard to guarantee the correctness and applicability of our products in some usage. Users should understand the product before using, and then decide the best way to use it.