Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Board Size: | 200*200m |
| Raw material | TG170°C CCL |
| Finished treatment | Immersion gold |
| Line width/space | 100um/100um |
| Drilling size | 200um |
| Min. Line Spacing: | 0.12mil |
| BGA size | 0.3mm |
| Brand Name | TOPCBS |
| Model Number | High TG CCL 8Layer main board using in electric power |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Board Size: | 200*200m | Raw material | TG170°C CCL |
| Finished treatment | Immersion gold | Line width/space | 100um/100um |
| Drilling size | 200um | Min. Line Spacing: | 0.12mil |
| BGA size | 0.3mm | Brand Name | TOPCBS |
| Model Number | High TG CCL 8Layer main board using in electric power | Certification | UL94V0 |
| Place of Origin | Suzhou China | ||
| High Light | multilayer aluminium pcb ，1OZ bare printed circuit board manufacturing ，multi layer pcb design | ||
PCB Assembly Board 1OZ Bare Printed Circuit Board
Hybrid PCB is also known as mixed material lamination, it’s normally combined by two different material like FR4 and PI(rigid flex PCB), FR4 and Ceramic, FR4 and Teflon, FR4 and Aluminum base etc.
The challenge to manufacture the Hybrid PCB is managing the different coefficient of thermal expansion properties of the dissimilar circuit materials both during PCB manufacturing and component assembly.
Hybrid PCB with a combination of FR4 material and PTFE material allows a designer to condense both RF functionality and RF functionality on the same PCB which can reduce both the footprint of the device and the cost.
When producing a printed circuit board with dissimilar materials it’s critically important to have experience in both the physical properties of the laminate and the capabilities of your equipment. Based upon the CTE values of all of the layers of material(ex FR4, PTFE and Copper), each material grows at a different rate during elevated thermal exposure. This can cause significant registration issues as one material shrinks while another one expands and it can also cause delamination of the copper-to substrate interfaces. Therefore, not all materials should be used in hybrid applications as they are not manufacturable regardless of the desired performance.
Hybrid multilayer PCBs often make use of circuit materials with very different values of dielectric constant (Dk). For example, some multilayer antenna circuits may consist of a low-Dk circuit material as the outside layer for radiating elements, a moderate-Dk circuit material internally for a stripline antenna feed line, and a high-Dk material for an internal layer for filter circuitry. The different Dk materials are often based on different resin systems. The outer, low-Dk layer may be PTFE material while the inner, moderateDk circuit layer is formed on a ceramic-filled hydrocarbon-based laminate. The bonding materials could be based on either type of material, although hydrocarbonbased bonding materials are more often used for their ease of circuit fabrication.
2 . Specifications:
| Name | 8Layer main board / immersion gold |
| Number of Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | IT180A + Rogers4350B + Copper Block |
| Thickness | 2.0mm |
| Min Track/Spacing | 100um/100um |
| Min drill Size | 0.2mm |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1OZ |
| Aspect ratio | 8:1 |
3. Product application
Printed circuit boards (PCBs) with characteristic impedance control are widely used in high frequency circuit. PCB's that mixed high frequency material can reduce signal loss at high frequencies and meet the development needs of communication technology.
It is mainly used in the infrastructure field of transmission cores including WDM/OTN end-to-end intelligent optical transmission platform, MSTP/multi-service transmission platform, microwave fusion transmission radio frequency, data communication system platform, and other information communication industries.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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