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China factory - Topmatch Electronics (Suzhou) Co., Limited.

Topmatch Electronics (Suzhou) Co., Limited.

  • China,Suzhou ,Jiangsu
  • Active Member

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China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint
China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint

  1. China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint
  2. China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint
  3. China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint
  4. China Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint

Hdi 3 Layer Flex Pcb Stiffener Fpc Pcb Design Immersion Gold In Fingerprint

  1. MOQ: Negotiation
  2. Price: Negotiation
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Payment Terms T/T
Supply Ability 10000unit per month
Delivery Time 10-14working days
Packaging Details 20units per package box size 20*15*10cm
Board type Flexible board
Application Fingerprint module
Material PI
Line Width/Spaceing 3 / 3mil
Finish treatment Immersion gold
Board thickness 120um
Brand Name TOPCBS
Model Number 3Layer flexible board using in fingerprint module
Certification UL94V0
Place of Origin Suzhou China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 10000unit per month
Delivery Time 10-14working days Packaging Details 20units per package box size 20*15*10cm
Board type Flexible board Application Fingerprint module
Material PI Line Width/Spaceing 3 / 3mil
Finish treatment Immersion gold Board thickness 120um
Brand Name TOPCBS Model Number 3Layer flexible board using in fingerprint module
Certification UL94V0 Place of Origin Suzhou China
High Light hdi flex pcbflex pcb with stiffenerpcb board stiffener

3Layer flexible board / steel stiffener immersion gold treatment using in fingerprint module

 

Benefits of Rigid-Flex PCBs

· Space requirements can be minimized by applying 3D

· By removing the need for connectors and cables between the individual rigid parts the board size and overall system weight can be reduced.

· By maximizing space, there is often a lower count in parts.

· Less solder joints assure higher connection reliability.

· Handling during assembly is easier in comparison with flexible boards.

. Simplified PCB assembly processes.

· Integrated ZIF contacts provide simple modular interfaces to the system environment.

· Test conditions are simplified. A complete test prior to installation becomes possible.

· Logistical and assembly costs are significantly reduced with Rigid-Flex boards.

· It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.

 

 

Specifications:

 

Name 3Layer flexible module
Number of Layers 3
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material Polymide(flex portion),Steel stiffener
Board Thickness 150um
Min Track/Spacing 3/3mil
Min drill Size 0.2mm
Coverlayer color Yellow
Silkscreen White
Surface Finish Immersion Gold
Finished Copper HOZ
Impendence control 100Om+/-8%
Bending angle 360°

What is Rigid-Flex printed circuit boards?

 

Rigid-Flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

 

Rigid-Flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

Rigid-Flex PCBs Fabrication Applications

Rigid-Flex PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.

In consumer products, Rigid-Flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but Rigid-Flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles.

Rigid-Flex PCBs Technology and Production Process

Whether producing a rigid flex prototype or production quantities requiring large scale Rigid-Flex PCBs fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of Rigid-Flex solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the Rigid-Flex PCBs fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The Rigid-Flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the Rigid-Flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 

Rigid-Flex Design and Fabrication Issues

During the Rigid-Flex PCBs design process, certain considerations must be taken into account for final product size variations. In the manufacture of Rigid-Flex boards, the flexible polyimide core will shrink once the bonded copper foil is etched away. This variation must be accounted for in the design process.

The final Rigid-Flex assembly process requires the flex portions to be bent into shape, stressing the flex laminations with the potential to cause stress fractures.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    1999

  • Total Annual:

    400 million-600 million

  • Employee Number:

    500~1000

  • Ecer Certification:

    Active Member

Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.     Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.    

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Get in touch with us

  • Reach Us
  • Topmatch Electronics (Suzhou) Co., Limited.
  • Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
  • https://www.hdi-pcbs.com/

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