Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| Name | DDR Socket PCB |
| Layer count | 10Layer |
| Board Thickness | 2.0mm |
| Vias | Blind vias，Buried vias,Fill Cu vias |
| Stack up | 10L anylayer ,4-2-4 |
| Finish treatment | Immersion gold |
| Unit size | 23.6*23.6mm(L*W) |
| Pitch size | 0.5P,0.4P,0.35P,0.3P |
| Surface treatment | Immersion gold |
| Brand Name | TOPCBS |
| Model Number | DDR Socket PCB |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| Name | DDR Socket PCB | Layer count | 10Layer |
| Board Thickness | 2.0mm | Vias | Blind vias，Buried vias,Fill Cu vias |
| Stack up | 10L anylayer ,4-2-4 | Finish treatment | Immersion gold |
| Unit size | 23.6*23.6mm(L*W) | Pitch size | 0.5P,0.4P,0.35P,0.3P |
| Surface treatment | Immersion gold | Brand Name | TOPCBS |
| Model Number | DDR Socket PCB | Certification | UL94V0 |
| Place of Origin | Suzhou China | ||
| High Light | Pcb Remote Control Drone Board ，Customized Remote Control Drone Board ，10 LayerDDR Socket PCB | ||
Customized Universal High Quality Pcb Remote Control Drone Board
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
2 . Specifications:
| Name | 2.0mm DDR3,DDR4 interposer PCBs |
| Number of Layers | 4-2-4 Layers |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Lead Free materials |
| Thickness | 2.0mm |
| Min Track/Spacing | 3/3mil |
| Min Hole Size | 0.075mm laser drilling |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1OZ |
| Lead time | 28-35 days |
| Quick turn service | Yes |
What is the PCB Layout Changes Needed for DDR4 Implementation?
DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.
So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.
Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).
Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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