HongRuiXing (Hubei) Electronics Co.,Ltd.
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 square meters per month |
| Delivery Time | 7-10 working days |
| Packaging Details | carton customized |
| Base Material | ultrathin pcb |
| Thickness | 0.2mm |
| Surface treatment | plating gold |
| Hole size | minimun 0.1mm |
| Copper thickness | 1/2OZ |
| Solder mask | Black |
| Brand Name | Horexs |
| Certification | UL |
| Place of Origin | china |
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Product Specification
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | Supply Ability | 30000 square meters per month |
| Delivery Time | 7-10 working days | Packaging Details | carton customized |
| Base Material | ultrathin pcb | Thickness | 0.2mm |
| Surface treatment | plating gold | Hole size | minimun 0.1mm |
| Copper thickness | 1/2OZ | Solder mask | Black |
| Brand Name | Horexs | Certification | UL |
| Place of Origin | china | ||
| High Light | 50um Line Space Ultra Thin Pcb ，0.4mm Ultra Thin Pcb ，0.1mm Ultra Thin Pcb | ||
Thickness 0.1-0.4mm Ultralthin PCB With Minimum 25um Line Width And 50um Line Space
Application:writing pad/touch pad,consumer electronics,Smart electronics;
Mini.Line space/width:1mil (25um)
Spec.of pcb production:
FR4 (0.15mm) finished thickness;
FR4 brand:SHENGYI or customize;
Surface finished:immersion gold;
Copper:0.5oz or Customize;
Soldermask:Green or Customize
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
When you send inquiry us,Pls be know that we have to get the following :
1-PCB production sepc. information;
2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)
3-Quantity request,Including sample;
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!
HOREXS 's mission is that help you save cost with same high quality guarantee!(Better price,Better quality).
Company Details
Business Type:
Manufacturer
Year Established:
2010
Total Annual:
50million-100million
Employee Number:
100~200
Ecer Certification：
Verified Supplier
HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in differen... HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in differen...
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