Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 1~2 Weeks |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm |
| Mold No. | HN23066 |
| Cavity Size/mm | 11.3*13.3*1.17 |
| Overall Dimension/mm | 322.6x135.9x12.19 |
| Material | PEI/MPPO |
| Matrix Quantity | 3X7=21PCS |
| Height | 12.19mm |
| Shaping Mode | Plasitc Injection Mould |
| Flatness | less than 0.76mm |
| Color | black(According to customer needs） |
| Peculiarity | Permanent antistatic |
| Temperature | 180°C for 2 hours |
| Experience | 14 years |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Clean Class | General and ultrasonic cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Brand Name | Hiner-pack |
| Model Number | HN23066 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 1~2 Weeks | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm |
| Mold No. | HN23066 | Cavity Size/mm | 11.3*13.3*1.17 |
| Overall Dimension/mm | 322.6x135.9x12.19 | Material | PEI/MPPO |
| Matrix Quantity | 3X7=21PCS | Height | 12.19mm |
| Shaping Mode | Plasitc Injection Mould | Flatness | less than 0.76mm |
| Color | black(According to customer needs） | Peculiarity | Permanent antistatic |
| Temperature | 180°C for 2 hours | Experience | 14 years |
| Incoterms | EXW,FOB,CIF,DDU,DDP | Clean Class | General and ultrasonic cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Brand Name | Hiner-pack |
| Model Number | HN23066 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China | ||
| High Light | 3X7 JEDEC IC Tray ，21PCS jedec matrix trays ，High Temperature JEDEC IC Tray | ||
Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray
JEDEC standard injection molded tray are mainly used for anti-static IC storage and PCB electronic component transportation and storage.
Main application areas:
Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly and testing.
R&D: Storing and testing new products in laboratories and R&D environments.
Logistics: Used in supply chain management to securely transport electronic compone Here are some key features and advantages about this type of pallet:
1. Durability:
The injection molded material has good durability and impact resistance to provide full protection during transportation.
2. Multi-purpose:
Suitable for the storage of a wide range of electronic components, such as integrated circuits (ICs), sensors, modules, etc.
3. lightweight design:Lightweight design facilitates handling and storage, improving logistics efficiency.
4. Improve reliability: Prevent static electricity from damaging chips and components, ensure product quality.
Reduces loss: Effectively protects components and reduces damage and waste during transportation and storage.
5. Simplify operation: Standardized pallet design facilitates quick identification and handling in production lines and warehouses.
Strong compatibility: Suitable for various package types, reducing inventory diversity and simplifying management.
JEDEC Tray Parameters
Materials used in JEDEC trays include MPPO, PEI (polyetherimide), PES (polyether sulfide) and PPE.
Below are the characteristics of these materials and their advantages:
1. MPPO
Characteristics: Excellent thermal stability and mechanical strength. Suitable for high temperature environment.
Advantages: High temperature resistance: suitable for use in high temperature conditions to prevent deformation.
Excellent electrical insulation: protects electronic components and reduces electrostatic damage.
Chemical stability: maintains stability in a wide range of chemical environments.
2. PEI (Polyetherimide)
Characteristics: Very high thermal stability and excellent mechanical properties. Can be used at temperatures up to 200°C.
Advantages: High heat resistance: suitable for high temperature processing and storage environments.
Excellent electrical insulation properties: effectively protects sensitive electronic components.
Excellent chemical resistance: able to resist a wide range of chemicals.
3. PES (Polyether Sulfide)
Characteristics: Combines the advantages of PEI, but with better toughness and thermal fluidity during injection molding. Suitable for a wide range of industrial applications.
Advantages: Good heat resistance: maintains physical properties in high temperature environments.
Chemical resistance: good resistance to a wide range of chemicals.
Excellent mechanical properties: provides additional protection during transportation and storage.
4. PPE
Characteristics: Good thermal stability and excellent electrical insulation properties.
Higher rigidity and strength.
Advantages: Excellent electrical insulation: effectively prevents static damage and protects electronic components.
High temperature resistance: suitable for use in high temperature environments to prevent deformation.
Chemical resistance: able to resist a wide range of chemicals, suitable for different application scenarios.
| Mold No. | 23066 |
| Cavity Size/mm | 11.3*13.3*1.17 |
| Overall Dimension/mm | 322.6x135.9x12.19 |
| Matrix Quantity | 3X7=21PCS |
| Material | PEI/MPPO |
Customer FAQ
Question 1: How long does it take to open the mold?
Sample mold: 20-25 days.
Soft mold: 12-15 days.
Hard mold: 15-20 days
Hard mold (>200T) 25-28 days.
Two-color production mold: 25-28 days
It depends on the requirement and complexity.
Question2: What services can we provide?
1.OEM/ODM service.
2.Professional mold design and production service.
3.Provide plastic parts assembly service.
4.Provide plastic parts packaging service.
5.Provide after-sales service.
Q6:How many kinds of plastic injection products you produce?
Mainly for consumer electronics,medical facilities,auto parts,digital electronics,computer accessories,semi conductor, labor protection and the other products.
Qelcome to enquiry.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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