Supply Ability | 30set per month |
Delivery Time | 20 work days |
Packaging Details | wooden case packing |
Name | laser Direct Imaging (LDI) |
Application | PCB HDI FPC |
Exposure Size Max | 260*810mm |
Line Width | 15μ |
Line Line Distance | 10% |
Line Width tolerance | 10% |
Alignment Capability | 12/24μm |
Laser Type | LD Laser, 405±5nm |
Efficient | 12S@18"*24" |
Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment |
File Format | Gerber 274X, ODB++ |
Brand Name | GIS |
Model Number | RTR315 |
Certification | ISO 9001 CE |
Place of Origin | Jiangsu, China |
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Product Specification
Supply Ability | 30set per month | Delivery Time | 20 work days |
Packaging Details | wooden case packing | Name | laser Direct Imaging (LDI) |
Application | PCB HDI FPC | Exposure Size Max | 260*810mm |
Line Width | 15μ | Line Line Distance | 10% |
Line Width tolerance | 10% | Alignment Capability | 12/24μm |
Laser Type | LD Laser, 405±5nm | Efficient | 12S@18"*24" |
Deviation increase and decrease | Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment | File Format | Gerber 274X, ODB++ |
Brand Name | GIS | Model Number | RTR315 |
Certification | ISO 9001 CE | Place of Origin | Jiangsu, China |
High Light | 3.5mm LDI Machine ,0.05mm LDI Machine ,ISO 9001 laser direct image |
laser direct imaging (LDI) system solutions LDI Flexible Board
(1) LDI technology adopts laser positioning and vertical laser beam scanning, which can ensure that the graphic position deviation is within ± 5um, which greatly improves the line alignment accuracy and position.
(2) LDI technology does not use negative film, which can meet the production of very high-density fine conductors, improve the qualification rate of fine line PCB manufacturing and avoid repeated positioning defects.
(3) LDI technology does not need to manufacture, preserve and maintain photographic film devices, consumed materials, energy, other auxiliary materials, and chemicals, which reduces the production and processing cost.
(4) LDI technology can shorten the PCB manufacturing process, reduce the turnaround time, improve the rapid response-ability, reduce the intervention of human factors, simplify the operation process, and then improve the production efficiency.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
Specification/model | RTR315 |
Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
Resolution (mass production) | 15um |
Capacity | 12S@18"*24" |
Exposure Size | 260*800mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | UV-Mark |
Alignment capability | Outer layer±12um;Inner laye±24um |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Other
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification:
Verified Supplier
Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov... Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov...
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