LT CIRCUIT CO.,LTD.
Products
Manufacturer of a wide range of products which include Advanced HDI Any Layer PCBs for Devices Min. Annular Ring 3mil Thickness 0.2mm-6,Customizable HDI Any Layer PCBs with FR-4 Material Minimum Hole Size 0.1mm,TACNIC TSM-DS3 HDI ...
MOQ:
Price:
| Min. Annular Ring | 3mil |
| Layer Count | Any Layer |
| Material | FR-4 |
| Solder Mask Color | Green, Red, Blue, Black, Yellow, White |
| Silkscreen Color | White, Black, Yellow |
| Min. Finished Hole Size | 0.1mm |
| Lead Time | 2-5 Days |
| Minimum Hole Size | 0.1mm |
MOQ:
Price:
| Layer Count | Any Layer |
| Testing | Flying Probe Test, E-test |
| Min. Annular Ring | 3mil |
| Impedance Control | Yes |
| Solder Mask Color | Green, Red, Blue, Black, Yellow, White |
| Thickness | 0.2mm-6.0mm |
| Copper Weight | 0.5oz-6oz |
| Silkscreen Color | White, Black, Yellow |
MOQ:
Price:
| Layers | 12 Layers |
| Material | TACNIC TSM-DS3 |
| Board Thickness | 2.9 MM |
| Copper thickness | 1 OZ |
| Surface finish | ENIG |
| Special technology | 4+N+4 HDI Rigid Flex PCBs |
MOQ:
Price:
| Max Layer | 32L |
| Minimum Trace/Space | 0.05mm |
| Layers | 4 Layer |
| Hole Position Deviation | ±0.05mm |
| Dimension | 41.55*131mm |
| Components | SMD, BGA, DIP, Etc. |
| Surface Finishing | HASL LF |
| Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
MOQ:
Price:
| Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
| Dimension | 41.55*131mm |
| Flexibility | 1-8 Times |
| Product Type | PCB Assembly |
| Surface Finishing | HASL LF |
| Bend Radius | 0.5-10mm |
| Components | SMD, BGA, DIP, Etc. |
| Minimum Trace/Space | 0.05mm |
MOQ:
Price:
| Pcb Layer | 1-28layers |
| Product Type | PCB Assembly |
| Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
| Dimension | 41.55*131mm |
| Profiling Punching | Routing, V-CUT, Beveling |
| Max Layer | 52L |
| No Of Layers | 4 Layer |
| Bend Radius | 0.5-10mm |
MOQ:
Price:
| Max Layer | 52L |
| Hole Position Deviation | ±0.05mm |
| Bend Radius | 0.5-10mm |
| Minimum Trace/Space | 0.1mm |
| Sanforized | Local High Density, Back Drill |
| Components | SMD, BGA, DIP, Etc. |
| Profiling Punching | Routing, V-CUT, Beveling |
| Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
MOQ:
Price:
| Hole Position Deviation | ±0.05mm |
| Sanforized | Local High Density, Back Drill |
| Pcb Layer | 1-28layers |
| Surface Finishing | HASL LF |
| Profiling Punching | Routing, V-CUT, Beveling |
| Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
| Components | SMD, BGA, DIP, Etc. |
| Flexibility | 1-8 Times |
MOQ:
Price:
| Surface Finishing | HASL LF |
| No Of Layers | 4 Layer |
| Material | FR4, Polyimide, PET |
| Bend Radius | 0.5-10mm |
| Flexibility | 1-8 Times |
| Minimum Trace/Space | 0.1mm |
| Product Type | PCB Assembly |
| Sanforized | Local High Density, Back Drill |
MOQ:
Price:
| No Of Layers | 4 Layer |
| Max Layer | 52L |
| Bend Radius | 0.5-10mm |
| Sanforized | Local High Density, Back Drill |
| Dimension | 41.55*131mm |
| Pcb Layer | 1-28layers |
| Material | FR4, Polyimide, PET |
| Flexibility | 1-8 Times |
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