Payment Terms | L/C T/T Western Union |
Supply Ability | 18,000,000PCS / Per Day |
Delivery Time | 1 - 2 Weeks |
Packaging Details | Boxed |
Product name | Mos Field Effect Transistor |
Model | AP15N10S |
Pack | SOP-8 |
Marking | AP15N10S XXX YYYY |
VDSDrain-Source Voltage | 100V |
VGSGate-Sou rce Voltage | ±20V |
Brand Name | Hua Xuan Yang |
Model Number | AP15N10S |
Certification | RoHS、SGS |
Place of Origin | ShenZhen China |
View Detail Information
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Product Specification
Payment Terms | L/C T/T Western Union | Supply Ability | 18,000,000PCS / Per Day |
Delivery Time | 1 - 2 Weeks | Packaging Details | Boxed |
Product name | Mos Field Effect Transistor | Model | AP15N10S |
Pack | SOP-8 | Marking | AP15N10S XXX YYYY |
VDSDrain-Source Voltage | 100V | VGSGate-Sou rce Voltage | ±20V |
Brand Name | Hua Xuan Yang | Model Number | AP15N10S |
Certification | RoHS、SGS | Place of Origin | ShenZhen China |
High Light | n channel mosfet transistor ,high voltage transistor |
AP15N10S Mos Field Effect Transistor / 15A 100V Logic Mosfet Switch
Mos Field Effect Transistor Introduction
Power MOSFETs are normally used in applications where voltages do not exceed about 200 volts. Higher voltages are not so easily achievable. Where the Power MOSFETs are used, it is their low ON resistance that is particularly attractive. This reduces power dissipation which reduces cost and size less metalwork and cooling is required. Also the low ON resistance means that efficiency levels can be maintained at a higher level
Mos Field Effect Transistor Features
VDS = 100V ID =15A
RDS(ON) < 120mΩ @ VGS=10V
Mos Field Effect Transistor Application
VDS = 100V ID =15A
RDS(ON) < 120mΩ @ VGS=10V
Package Marking and Ordering Information
Product ID | Pack | Marking | Qty(PCS) |
AP15N10S | SOP-8 | AP15N10S XXX YYYY | 3000 |
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Symbol | Parameter | Rating | Units |
VDS | Drain-Source Voltage | 100 | V |
VGS | Gate-Sou rce Voltage | ±20 | V |
ID@TA=25℃ | Continuous Drain Current, V GS @ 10V 1 | 15 | A |
ID@TA=70℃ | Continuous Drain Current, V GS @ 10V 1 | 7 | A |
IDM | Pulsed Drain Current2 | 30 | A |
EAS | Single Pulse Avalanche Energy 3 | 6.1 | mJ |
IAS | Avalanche Current | 11 | A |
PD@TA=25 ℃ | Total Power Dissipation3 | 1.5 | W |
TSTG | Storage Temperature Range | -55 to 150 | ℃ |
TJ | Operating Junction Temperature Range | -55 to 150 | ℃ |
RθJA | Thermal Resistance Junction-ambient 1 | 85 | ℃/W |
RθJC | Thermal Resistance Junction-Case 1 | 36 | ℃/W |
Electrical Characteristics (TJ=25 ℃, unless otherwise noted
Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=250uA | 100 | --- | --- | V |
△ BVDSS/△TJ | BVDSS Temperature Coefficient | Reference to 25℃ , ID=1mA | --- | 0.098 | --- | V/℃ |
RDS(ON) |
Static Drain-Source On-Resistance |
VGS=10V , I D=2A | --- | 90 | 112 | mΩ |
VGS=4.5V , ID=1A | --- | 95 | 120 | mΩ | ||
VGS(th) | Gate Threshold Voltage | 1.0 | 1.5 | 2.5 | V | |
△VGS(th) | VGS(th) Temperature Coefficient | --- | -4.57 | --- | mV/℃ | |
IDSS |
Drain-Source Leakage Current |
VDS=80V , VGS=0V , TJ=25℃ | --- | --- | 10 |
uA |
VDS=80V , VGS=0V , TJ=55℃ | --- | --- | 100 | |||
IGSS | Gate-Source Leakage Current | VGS=±20V , VDS=0V | --- | --- | ±100 | nA |
gfs | Forward Transconductance | VDS=5V , ID=2A | --- | 12 | --- | S |
Rg | Gate Resistance | VDS=0V , VGS=0V , f=1MHz | --- | 2 | 4 | |
Qg | Total Gate Charge (10V) | --- | 19.5 | --- | ||
Qgs | Gate-Source Charge | --- | 3.2 | --- | ||
Qgd | Gate-Drain Charge | --- | 3.6 | --- | ||
Td(on) | Turn-On Delay Time |
VDD=50V , VGS=10V , |
--- | 16.2 | --- | |
Tr | Rise Time | --- | 3 | --- | ||
Td(off) | Turn-Off Delay Time | --- | 44 | --- | ||
Tf | Fall Time | --- | 2.6 | --- | ||
Ciss | Input Capacitance | --- | 1535 | --- | ||
Coss | Output Capacitance | --- | 60 | --- | ||
Crss | Reverse Transfer Capacitance | --- | 37.4 | --- | ||
IS | Continuous Source Current 1,5 |
VG=VD=0V , Force Current |
--- | --- | 4 | A |
ISM | Pulsed Source Current 2,5 | --- | --- | 8 | A | |
VSD | Diode Forward Voltage2 | VGS=0V , IS=1A , TJ=25℃ | --- | --- | 1.2 | V |
Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=250uA | 100 | --- | --- | V |
△ BVDSS/△TJ | BVDSS Temperature Coefficient | Reference to 25℃ , ID=1mA | --- | 0.098 | --- | V/℃ |
RDS(ON) |
Static Drain-Source On-Resistance |
VGS=10V , I D=2A | --- | 90 | 112 | mΩ |
VGS=4.5V , ID=1A | --- | 95 | 120 | mΩ | ||
VGS(th) | Gate Threshold Voltage | 1.0 | 1.5 | 2.5 | V | |
△VGS(th) | VGS(th) Temperature Coefficient | --- | -4.57 | --- | mV/℃ | |
IDSS |
Drain-Source Leakage Current |
VDS=80V , VGS=0V , TJ=25℃ | --- | --- | 10 |
uA |
VDS=80V , VGS=0V , TJ=55℃ | --- | --- | 100 | |||
IGSS | Gate-Source Leakage Current | VGS=±20V , VDS=0V | --- | --- | ±100 | nA |
gfs | Forward Transconductance | VDS=5V , ID=2A | --- | 12 | --- | S |
Rg | Gate Resistance | VDS=0V , VGS=0V , f=1MHz | --- | 2 | 4 | |
Qg | Total Gate Charge (10V) | --- | 19.5 | --- | ||
Qgs | Gate-Source Charge | --- | 3.2 | --- | ||
Qgd | Gate-Drain Charge | --- | 3.6 | --- | ||
Td(on) | Turn-On Delay Time |
VDD=50V , VGS=10V , |
--- | 16.2 | --- | |
Tr | Rise Time | --- | 3 | --- | ||
Td(off) | Turn-Off Delay Time | --- | 44 | --- | ||
Tf | Fall Time | --- | 2.6 | --- | ||
Ciss | Input Capacitance | --- | 1535 | --- | ||
Coss | Output Capacitance | --- | 60 | --- | ||
Crss | Reverse Transfer Capacitance | --- | 37.4 | --- | ||
IS | Continuous Source Current 1,5 |
VG=VD=0V , Force Current |
--- | --- | 4 | A |
ISM | Pulsed Source Current 2,5 | --- | --- | 8 | A | |
VSD | Diode Forward Voltage2 | VGS=0V , IS=1A , TJ=25℃ | --- | --- | 1.2 | V |
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=11A
4.The power dissipation is limited by 175℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation
Attention
1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.
2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.
3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.
4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.
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8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
8000000-10000000
Employee Number:
150~200
Ecer Certification:
Active Member
Shenzhen Huaxuan Yang Electronics Co., Ltd. is a professional manufacturer, exporter and manufacturer of electronic components of Chinese brands. The main products are semiconductor devices such as MOS transistors and diodes. Our products are mainly used for wireless charging, charger, switching... Shenzhen Huaxuan Yang Electronics Co., Ltd. is a professional manufacturer, exporter and manufacturer of electronic components of Chinese brands. The main products are semiconductor devices such as MOS transistors and diodes. Our products are mainly used for wireless charging, charger, switching...
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