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Revolutionize Your Manufacturing Process with SOM Module LCB3568
Product Description:
The LCB3568 is a compact yet powerful core module built on the Rockchip RK3568 series chip platform, including the RK3568 and RK3568J variants. Measuring just 60mm x 40mm, it connects to the baseboard via four dual-slot 0.5mm pitch 80Pin board-to-board connectors, secured with four M2 screws for enhanced stability and reliability, ensuring effortless installation and maintenance.
Equipped with a CPU, DDR, eMMC, and PMU, the module offers flexible performance options. The CPU is either the RK3568 or RK3568J. It features LPDDR4 memory (available in 1GB, 2GB, or 4GB configurations) for low power consumption and high frequency, and high-speed eMMC 5.1 storage ranging from 4GB to 128GB. The PMU integrates the RK809 and advanced DC-DC and LDO components, supporting DVFS for efficient power management.
With a modular design approach, the LCB3568 exposes all CPU functional pins, thoroughly tested and validated for mass production. This design simplifies product development, reduces costs, and accelerates time-to-market, making it an ideal choice for industrial applications.
Technical Parameters:
Function
Description
CPU
RK3568, 22nm process, quad-core 64-bit Cortex-A55, with a maximum clock speed of 2.0GHz.
GPU
ARM G52 2EE, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1,
and has a high-quality 2D graphics engine built-in.
NPU
Offers up to 1 TOPS of computational power; supports hybrid operations of INT8/INT16/FP16/BFP16 MAC; compatible with deep-learning frameworks such as TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, and Darknet.
VPU
Capable of 4K VP9 and 4K H265 video decoding at up to 60fps.
Capable of 1080P H265/H264 video encoding at up to 100fps.
Equipped with an 8M ISP with HDR capabilities.
DDR
LPDDR4 RAM, with options for 1GB/2GB/4GB/8GB (Optional).
eMMC
eMMC 5.1 storage, with options for 8GB/16GB/32GB/64GB/128GB (Optional).
PMU
RK806
OS
Android / Ubuntu / Buildroot / Debian
Camera Interface
Compatible with the MIPI Alliance Interface specification v1.2 Up to 4 data lanes, 2.5Gbps maximum data rate per lane One interface with 1 clock lane and 4 data lanes Two interface, each with 1 clock lane and 2 data lanes Support up to 16bit DVP interface (digital parallel input) Support ISP block(Image Signal Processor)
Display Interface
RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC Support three simultaneous displays HDR10/HDR HLG/ HDR2SDR/SDR2HDR 3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLOR BAR
USB Interface
1 x USB3.0 HOST, 1 x USB3.0 OTG, 2 x USB2.0 HOST
PCIe3.0 PHY Interface
Support PCIe3.1(8Gbps) protocol and backward compatible with the PCIe2.1 and PCIe1.1 protocol Support two lane Support two PCIe controller with x1 mode or one PCIe controller with x2 mode Dual operation mode: Root Complex(RC)and End Point(EP)
Multi-PHY Interface
Support three multi-PHYs with PCIe2.1/SATA3.0/USB3.0/QSGMII controller USB3 Host controller + USB3 OTG controller PCIe2.1 controller / three SATA controller
Audio Interface
I2S0 with 8 channel TX and RX I2S1 with 8 channel TX and RX I2S2/I2S3 with 2 channel TX and RX PDM with 8channel TDM supports up to 8 channels for TX and 8 channels RX path
Connectivity
Compatible with SDIO 3.0 protocol GMAC 10/100/1000M Ethernet Controller Four on-chip SPI controllers Ten on-chip UART controllers inside Six on-chip I2C controllers Smart Card with ISO-7816 Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation Multiple groups of GPIO 8 single-ended input channels SARADC with 10bits resolution up to 1MS/s sampling rate
Operating temperature
Enterprise Grade: -20°C to 70°C Industrial Grade: -40°C to 85°C
PCB interface
B2B,320 Pin
PCB layers
10 layers
PCB size
L* W *H(mm):60 *40 * 7.8(PCB thickness 1.6mm)
Support and Services:
Our SBC product technical support and services include:
Hardware and software design support
Customization services based on customer requirements
Technical consultation and guidance on SoM integration
Documentation and reference design materials
Testing and validation services
Product life cycle management and support
Packing and Shipping:
Product Packaging for System On Module SoM:
The Product will be packaged in an anti-static bag to prevent any damage during transportation.
The anti-static bag will then be placed in a cardboard box with adequate padding to prevent any damage during shipping.
The cardboard box will have a label indicating the product name, quantity, and any other relevant information.
Shipping Information:
The shipping method will be chosen by the customer at the time of purchase.
We offer worldwide shipping to all countries.
Shipping costs will be calculated based on the customer's location and the chosen shipping method.
The estimated shipping time will be provided to the customer at the time of purchase.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Exporter
Year Established:
2014
Total Annual:
100000-1000000
Employee Number:
20~100
Ecer Certification：
Verified Supplier
Shanghai Neardi Technology Co., Ltd. was established in 2014. It is a national high-tech enterprise and an official strategic partner of Rockchip. It focuses on the research and development and production of enterprise-level open-source hardware platforms, providing customers with core modules, indu... Shanghai Neardi Technology Co., Ltd. was established in 2014. It is a national high-tech enterprise and an official strategic partner of Rockchip. It focuses on the research and development and production of enterprise-level open-source hardware platforms, providing customers with core modules, indu...
