Payment Terms | T/T, Western Union, MoneyGram,Paypal |
Supply Ability | 1000PCS in stock |
Delivery Time | 3 work days |
Packaging Details | Vacuum package |
Flash | 32Mbit |
Support | WPA/WPA2 |
Integrated | TCP/IP Stack |
RAM | 50KB(Available) |
Package | SMD |
Brand Name | OEM |
Model Number | ESP8266-12F |
Certification | CE, FCC |
Place of Origin | China |
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Product Specification
Payment Terms | T/T, Western Union, MoneyGram,Paypal | Supply Ability | 1000PCS in stock |
Delivery Time | 3 work days | Packaging Details | Vacuum package |
Flash | 32Mbit | Support | WPA/WPA2 |
Integrated | TCP/IP Stack | RAM | 50KB(Available) |
Package | SMD | Brand Name | OEM |
Model Number | ESP8266-12F | Certification | CE, FCC |
Place of Origin | China | ||
High Light | sierra wireless modules ,electronic component sourcing |
ESP8266 ESP12f AI-Thinker Module mit 32 MB Flash Memory
Main Features
1. Operating Voltage: 3.3V
2. Operating Temperature:-40 - 85°C
3. CPU Tensilica L106
4. RAM:50KB(Available)
5. Flash:32Mbit
6. System
7. 802.11 b/g/n
8. IntegratedTensilica L106 ultra-low power 32-bitmicro MCU, with 16-bit RSIC.
9. The CPU clock speed is 80MHz. It can also reach a maximum value of 160MHz.
10.WIFI 2.4 GHz Support WPA/WPA2
11.Ultra-Small 18.6mm*15.0mm
12.Integrated10 bit high precision ADC
13.IntegratedTCP/IP Stack
14.IntegratedTR switch, balun,LNA, Power amplifier and matching network
15.Integrated PLL, Regulator and power source management components, +20 dBm output power in 802.11b mode
16.Supports antenna diversity
17.Deep sleep current < 20uA, Power down leakage current < 5uA
18.Rich interface on processor: SDIO 2.0, (H)SPI, UART, I2C, I2S, IRDA, PWM, GPIO
19.STBC, 1x1 MIMO, 2x1MIMO, A-MPDU & A-MSDU aggregation & 0.4s guard interval
20.Wake up ,build the connection and transmit packets in < 2ms
21.Standby power consumption<1.0mW (DTIM3)
22.Support AT remote upgrades and cloud OTA upgrade
23.Support STA/AP/STA+AP operation modes
24.FCC/CE/RoHs
Module Pictures
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2005
Total Annual:
8 million-10 million
Employee Number:
250~300
Ecer Certification:
Active Member
The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper... The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper...
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