Shenzhen Shinelink Technology Ltd
| Payment Terms | T/T, Western Union, MoneyGram,Paypal |
| Supply Ability | 10000pcs per day |
| Delivery Time | 5-7 days |
| Packaging Details | ESD package |
| Service | One Stop Turnkey Service |
| Standards | IPC-A-610 E Class II-III |
| Application | Consumer electronics |
| Features 1 | Gerber/PCB file needed |
| Features 2 | 100% E-test |
| Features 3 | Quality 2 years guarantee |
| Brand Name | OEM and ODM |
| Model Number | SL81104S09 |
| Certification | UL,RoHS, CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram,Paypal | Supply Ability | 10000pcs per day |
| Delivery Time | 5-7 days | Packaging Details | ESD package |
| Service | One Stop Turnkey Service | Standards | IPC-A-610 E Class II-III |
| Application | Consumer electronics | Features 1 | Gerber/PCB file needed |
| Features 2 | 100% E-test | Features 3 | Quality 2 years guarantee |
| Brand Name | OEM and ODM | Model Number | SL81104S09 |
| Certification | UL,RoHS, CE | Place of Origin | China |
| High Light | prototype pcb board ，electronics prototyping board | ||
High complexity PCB Prototype 1-18 layers Multilayers PCB RoHS 94v0
| PCB Cu Thickness + Plating | |
| Out Layer Cu Thickness | 1 - 6OZ |
| Inner Layer Cu Thickness | 0.5 - 4OZ |
| Cu Thickness of PTH | 20UM ≤ Average ≤ 25UM |
| Min: 18UM | |
| HASL with Lead | Tin 63% Lead 37% |
| HASL Free Lead | 7UM ≤ Surface Thickness ≤ 12UM |
| Thick Gold Plating | Ni Thickness: 3 - 5UM ( 120u" - 200u" ) |
| Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) | |
| Immersion Gold | Ni Thckness: 3 - 5UM ( 120u" - 200u" ) |
| Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) | |
| Immersion Silver | Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) |
| Gold Finger | Ni Thickness: 3 - 5UM ( 120u" - 160u" ) |
| Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) | |
| U940 PCB Pattern Limit Capability |
|
| Min Width | 0.075MM ( 3 mil ) |
| Min Trace | 0.075MM ( 3 mil ) |
| Min Width of Ring ( Inner Layer ) | 0.15MM ( 6 mil ) |
| Min Width of Ring ( Out Layer ) | 0.1MM ( 4 mil ) |
| Min Solder Bridge | 0.1MM ( 4 mil ) |
| Min Height of Legend | 0.7MM ( 28 mil ) |
| Min Width of Legend | 0.15MM ( 6 mil ) |
Reference - Our Production Capability for Rigid PCB
1) Layer: 1-18 Layers
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size: 3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
8) Copper thickness: 0.5-7.0 OZ
9) Solder mask color: green/yellow/black/white/red/blue
10) Copper thickness in hole: >25.0 um (>1mil)
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001
14) Special requirements: Buried and blind vias+controlled impedance +BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
PCB Capacity
| Item | Capability---Technology |
| Standard | IPC-A-610 E Class II-III |
| Laminate/Base Material | FR-4 / PI (FPC) / High TG FR-4 / Halogen Free material/Rogers/Arlon/ Taconic/Teflon/CEM-3/PTFE/Aluminum /BT |
| Layers | 1-18 |
| Finised inner/outer copper thickness | 1-6 OZ |
| Board Thinkness | 0.2-5.0mm |
| Min hole size | Mechanical hole: 0.15mm |
| Laser hole: 0.1mm | |
| Min line width/space | 0.075mm/0.075mm |
| Min line Gap | +/-10% |
| Aspect Ratio | 12:1 |
| Controlled Impedance | <= +/-10% |
| Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey,Purple etc.. |
| Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Surface treatment | HASL, HASL lead free, Immersion Gold,ENEPIG, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP... |
| Tolerance of dimension size | +/-0.1mm |
| Capacity | 35000sq/Month |
| CAM Capability | 40 item |
PCB Photos
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2005
Total Annual:
8 million-10 million
Employee Number:
250~300
Ecer Certification：
Active Member
The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper... The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper...
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