FASTPCBA Co., Ltd.
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000pcs/month |
| Delivery Time | 1-30 work days |
| Packaging Details | PCB: Vacuum Packing / PCBA: ESD Packing |
| Name | ENIG Multilayer PCBs Metal Core Printed Circuit Board PCB Board Soldering |
| Keyword | Custom Pc Board |
| Service | Pcb Fabrication Service |
| Plate material | Copper foil without glass fiber, FR4 |
| PCB layers | 1-48 layers |
| Board thickness | 2.0±0.15mm |
| Minimum aperture | 0.1mm |
| Surface treatment | ENIG |
| BGA size | 0.25mm |
| Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
| Brand Name | FASTPCBA |
| Model Number | Customized Pcb Board Manufacturing |
| Certification | ISO13485, IATF16949, ISO9001,IOS14001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 30000pcs/month |
| Delivery Time | 1-30 work days | Packaging Details | PCB: Vacuum Packing / PCBA: ESD Packing |
| Name | ENIG Multilayer PCBs Metal Core Printed Circuit Board PCB Board Soldering | Keyword | Custom Pc Board |
| Service | Pcb Fabrication Service | Plate material | Copper foil without glass fiber, FR4 |
| PCB layers | 1-48 layers | Board thickness | 2.0±0.15mm |
| Minimum aperture | 0.1mm | Surface treatment | ENIG |
| BGA size | 0.25mm | Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
| Brand Name | FASTPCBA | Model Number | Customized Pcb Board Manufacturing |
| Certification | ISO13485, IATF16949, ISO9001,IOS14001 | Place of Origin | China |
| High Light | Metal Core PCB Manufacturer ，metal core pcb manufacturing process ，Metal Core PCB | ||
0.25mm ENIG Metal Core Printed Circuit Board Pcb Fabrication Service
Metal Core Printed Circuit Board High Density Interconnect Pcb Fabrication Service
FASTPCBA Electronics Co., Ltd. is a professional PCB manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first class manufacturer of HDI PCB, with production capability 35,000 square meters. FASTPCBA is providing high quality bare PCB and PCB assembly service,including components sourcing, function test,conformal coating and complete assembly for clients all over the world, Our main market is Europe, north USA, Australia, South America, and Asia.
FASTPCBA has been selected as the “excellent partner of the year” by numerous well-known enterprises, and won many domestic and authorized certifications at home and abroad, such as Chinese high-tech project certification, ISO9001, ISO14001, ISO13485, IATF16949 quality management system standard and customized CE, UL, FCC and other product certifications according to the customer's requirements.
High Density Interconnector Pcb Manufacturing
HDI high-frequency circuit board is a circuit board with a relatively high line distribution density using micro-blind buried hole technology. It is designed for compact electronic products for small-capacity users.
It adopts modular design for parallel connection. The capacity of one module is 1000VA (height 1U). It is naturally cooled and can be directly put into a 19″ rack. It can connect up to 6 modules in parallel.
Using all-digital signal processing (DSP) technology and a number of patented technologies, it has a full range of load capacity and strong short-term overload capability, regardless of the load power factor and crest factor.
HDI printed circuit board is a structural element formed by insulating material supplemented by conductor wiring.
HDI PCB manufacturing capabilities:
Plate material | Copper foil without glass fiber, FR4 |
PCB layers | 1-48 layers |
Board thickness | 2.0±0.15mm |
Minimum aperture | 0.1mm |
Surface treatment | ENIG |
BGA size | 0.25mm |
Surface Finishing | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card |
Minimum line width/distance | 0.13mm/0.15mm |
Blind hole structure | 1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers |
Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
We have imported the advanced machinery from US,Japan,German and Israel to improve our production and technical ability.We have set a great example the PCB field of flying probe testing,buried and blind via and special controlled impedance.We have a highly developed R&D division which has helped our factory successfully produce mechanical micro via,high density impedance and HDI.
Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, intelligent home and other industries around the world. We will continue to improve our quality and service; customer satisfaction and development of science and technology are our eternal motivation.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
100~200
Ecer Certification：
Active Member
FASTPCBA Co., Ltd. is a professional PCB manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first class manufacturer of PCB /PCBA. FASTPCBA is providing high quality bare PCB and PCB assembly service,including components sourcing, function test,conformal coating and ... FASTPCBA Co., Ltd. is a professional PCB manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first class manufacturer of PCB /PCBA. FASTPCBA is providing high quality bare PCB and PCB assembly service,including components sourcing, function test,conformal coating and ...
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