Product Specification

8-layers HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing,carton packaging SMT PCB Service,+ SMT + plug-in + back soldering

Product Description

1. 8-layer HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing,carton packaging SMT PCB Service
2. 8-layer automotive product PCBA
3. 8-layer HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing
4. Detailed Product Description

   Printed circuit board (pcb) and PCBA products
   Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
   Flexible circuit board (FPC) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCBA processing method

1. PCB production + it contains SMT, DIP, TEST,
2. Helpset, assembled OEM factory
3.  Electronic materials supply or our purchasing method

PCBA multiple packaging methods:

1.  Inner box for electrostatic film simple packaging + wooden box or carton packaging
2. inner box plastic box + wooden box or carton packaging
3. vacuum packaging + wooden box or carton packaging
4. Packing is done according to your requirements

Quality Processes:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)

2. First Article Inspection (FAI) for every process

3. IPQC: In Process Quality Control

4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)

Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities

PCB, FPC process production capability

PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

Testing Methods
 

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing