Payment Terms | T/T, Western Union |
Supply Ability | 5-200K/pcs per month |
Delivery Time | 20-25day |
Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Board thickness | 1.6mm-3.2mm |
Copper thickness | 1/2/3/4/5 oz |
Base material | FR-4/aluminum/ceramic |
Min. line spacing | 0.075mm |
Min. line width | 0.1mm/4mi |
Min. hole size | 0.075mm(3mil) |
Surface finishing | ENIG |
Product name | Shenzhen Custom Multilayer pcb printed circuit board |
Solder mask color | White Black Yellow Green Red |
Application | pcb printed circuit board |
Solder mask | Green. Red. Blue. White. Black.Yellow,green |
Name | 94v0 Multilayer PCB Boards Printing Circuit Board,5.1 amplifier pcb printed circuit board multilayer pcb manufacture,Industrial Control PCBA Customize Multilayer Printed Circuit Board |
Service | One Stop Turnkey Service |
Layers | 1~28 |
Usage | for cellphone battery |
Material | FR4 Hight TG |
Brand Name | China chao sheng |
Model Number | 12 layers of inner and outer 10OZ thick copper plate |
Place of Origin | Shenzhen, Guangdong, China |
Certification | ISO/UL/RoHS/TS |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 5-200K/pcs per month |
Delivery Time | 20-25day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Board thickness | 1.6mm-3.2mm | Copper thickness | 1/2/3/4/5 oz |
Base material | FR-4/aluminum/ceramic | Min. line spacing | 0.075mm |
Min. line width | 0.1mm/4mi | Min. hole size | 0.075mm(3mil) |
Surface finishing | ENIG | Product name | Shenzhen Custom Multilayer pcb printed circuit board |
Solder mask color | White Black Yellow Green Red | Application | pcb printed circuit board |
Solder mask | Green. Red. Blue. White. Black.Yellow,green | Name | 94v0 Multilayer PCB Boards Printing Circuit Board,5.1 amplifier pcb printed circuit board multilayer pcb manufacture,Industrial Control PCBA Customize Multilayer Printed Circuit Board |
Service | One Stop Turnkey Service | Layers | 1~28 |
Usage | for cellphone battery | Material | FR4 Hight TG |
Brand Name | China chao sheng | Model Number | 12 layers of inner and outer 10OZ thick copper plate |
Place of Origin | Shenzhen, Guangdong, China | Certification | ISO/UL/RoHS/TS |
High Light | circuit board prototyping service ,order custom circuit board |
12 layers of inner and outer 10OZ thick copper plate PCB Board Service rigid flex pcb design
Product Description
PCB Board Application
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products12 layers of inner and outer 10OZ thick copper plate PCB Board Service rigid flex pcb design
About Us:
Quality
Our UL/Rohs standards for quality assemblies from start to finish by a team of experienced management directors and efficient production workers, with its sustainable development, career planning, advanced training-system and satisfactory welfare for all staff. On the other hand, TOP strives to improve quality and lead time through management and technology innovation.
Competitive price
Our experienced management team keep the management and production cost under controlled. These advantages provide enough profits to TOP, as well as greatly reduce customer's purchase cost.
PCB process production capability
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
Technicalltem | Mass Product | Advanced Technolgy | |||||
2017year | 2018year | 2019year | |||||
Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
Multi-layer overlay | N+N | N+N | N+N | ||||
N+X+N | N+X+N | N+X+N | |||||
sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill Electroplated hole/copper plug hole |
||||
PCB, FPC main material supply
NO | supplier | Supply material name | Material origin | |||||
1 | Japan | High frequency materials, PI, covering membrane,Copper berth | Mitsubishi Japan | |||||
2 | dupont | High frequency materials, PI, covering film, dry film,Copper berth | Japan | |||||
3 | panasonic | High frequency materials, PI, covering membrane,Copper berth | Japan | |||||
4 | SanTie | PI, covering membrane | Japan | |||||
5 | Born good | FR-4,PI,PP,Copper berth | shenzhen, China | |||||
6 | A rainbow | PI, covering membrane,Copper berth | Taiwan | |||||
7 | teflon | High frequency materials | The United States | |||||
8 | Rogers | High frequency materials | The United States | |||||
9 | Nippon Steel | PI, covering membrane,Copper berth | Taiwan | |||||
10 | sanyo | PI, covering membrane,Copper berth | Japan | |||||
11 | South Asia | FR-4,PI,PP,Copper berth | Taiwan | |||||
12 | doosan | FR-4,PP | South Korea | |||||
13 | Tai Yao plate | FR-4,PP,Copper berth | Taiwan | |||||
14 | Alight | FR-4,PP,Copper berth | Taiwan | |||||
15 | Yaoguang | FR-4,PP,Copper berth | Taiwan | |||||
16 | Yalong | FR-4,PP | The United States | |||||
17 | ISOAL | FR-4,PP | Japan | |||||
18 | OAK | Buried, buried resistance, PP | Japan | |||||
19 | United States 3M | FR-4,PP | The United States | |||||
20 | Bergs | Copper and aluminum matrix | Japan | |||||
21 | The sun | ink | Taiwan | |||||
22 | Murata | ink | Japan | |||||
23 | generous andbenevolent | PI, covering membrane,Copper berth | China's jiangxi | |||||
24 | Yasen | PPI, covering membrane | China jiangsu | |||||
25 | Yong Sheng Tai | ink | China guangdong panyu | |||||
26 | mita | ink | Japan | |||||
27 | Transcript | ceramic material | Taiwan | |||||
28 | HOME | ceramic material | Japan | |||||
29 | Fe-Ni-Mn | Alloy Invar, Section Steel |
Taiwan |
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.
For Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products12 layers of inner and outer 10OZ thick copper plate PCB Board Service rigid flex pcb design
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification:
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
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