Shenzhen Chaosheng Electronic Technology Co.,Ltd

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Custom Printed Circuit Board Assembly 1OZ High Output Fast Prototyping

China Custom Printed Circuit Board Assembly 1OZ High Output Fast Prototyping

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Custom Printed Circuit Board Assembly 1OZ High Output Fast Prototyping

MOQ： 1PCS
Price： Negotiation
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Payment Terms	T/T, Western Union
Supply Ability	5-200K/pcs per month
Delivery Time	22-25day
Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Copper thickness	1oz,1/2OZ 1OZ 2OZ 3OZ
Surface finishing	ENIG
Board thickness	0.3mm-6mm
Base material	FR-4
Material	FR4,aluminum
Solder mask color	Yellow
Layer	1-24 layers (include Rigid-Flex PCB)
Solder mask	green
Layers	4-30 layers
Min plated drills to copper	0.25mm
Min. line spacing	0.1mm4mil)
Min. line width	0.1mm
Product name	China oem factory smt printed circuit boards pcb assembly service
Service	One-stop Turnkey Service
Type	PCB Design
Usage	Lithium Battery Packs
Brand Name	China chao sheng
Model Number	6L3 order HDI plate thickness 0.50mm;
Place of Origin	Shenzhen, Guangdong, China
Certification	ISO/UL/RoHS/TS

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Product Details
Company Details

Product Specification


Payment Terms	T/T, Western Union	Supply Ability	5-200K/pcs per month
Delivery Time	22-25day	Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Copper thickness	1oz,1/2OZ 1OZ 2OZ 3OZ	Surface finishing	ENIG
Board thickness	0.3mm-6mm	Base material	FR-4
Material	FR4,aluminum	Solder mask color	Yellow
Layer	1-24 layers (include Rigid-Flex PCB)	Solder mask	green
Layers	4-30 layers	Min plated drills to copper	0.25mm
Min. line spacing	0.1mm4mil)	Min. line width	0.1mm
Product name	China oem factory smt printed circuit boards pcb assembly service	Service	One-stop Turnkey Service
Type	PCB Design	Usage	Lithium Battery Packs
Brand Name	China chao sheng	Model Number	6L3 order HDI plate thickness 0.50mm;
Place of Origin	Shenzhen, Guangdong, China	Certification	ISO/UL/RoHS/TS
High Light	dual layer pcb ，flexible printed circuit board

6L3 order HDI plate thickness 0.50mm;FR-4+TG150, minimum hole 0.35mm,printed circuit board,dual layer pcb

Product Description

Product area: battery products
Number of layers: 6L3 order HDI plate thickness 0.50mm;
Process structure: FR-4+TG150, minimum hole 0.35mm, copper thickness
1OZ, line width line spacing 3/3mil,Impedance Ω ± 10%
Surface treatment: electric gold 1u"
Quantities range from prototype to volume production.
100% E-Test
Packing: vacuum packaging + humidity card + moisture-proof beads + carton
Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered
Free Sample - Sample for free before mass production
Quality Control - Sales Team monitors the production quality and lead time
On Time Delivery - Customize the logistics plan according to customer’s requirement
After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO	supplier	Supply material name	Material origin
1	Japan	High frequency materials, PI, covering membrane,Copper berth	Mitsubishi Japan
2	dupont	High frequency materials, PI, covering film, dry film,Copper berth	Japan
3	panasonic	High frequency materials, PI, covering membrane,Copper berth	Japan
4	SanTie	PI, covering membrane	Japan
5	Born good	FR-4,PI,PP,Copper berth	shenzhen, China
6	A rainbow	PI, covering membrane,Copper berth	Taiwan
7	teflon	High frequency materials	The United States
8	Rogers	High frequency materials	The United States
9	Nippon Steel	PI, covering membrane,Copper berth	Taiwan
10	sanyo	PI, covering membrane,Copper berth	Japan
11	South Asia	FR-4,PI,PP,Copper berth	Taiwan
12	doosan	FR-4,PP	South Korea
13	Tai Yao plate	FR-4,PP,Copper berth	Taiwan
14	Alight	FR-4,PP,Copper berth	Taiwan
15	Yaoguang	FR-4,PP,Copper berth	Taiwan
16	Yalong	FR-4,PP	The United States
17	ISOAL	FR-4,PP	Japan
18	OAK	Buried, buried resistance, PP	Japan
19	United States 3M	FR-4,PP	The United States
20	Bergs	Copper and aluminum matrix	Japan
21	The sun	ink	Taiwan
22	Murata	ink	Japan
23	generous andbenevolent	PI, covering membrane,Copper berth	China's jiangxi
24	Yasen	PPI, covering membrane	China jiangsu
25	Yong Sheng Tai	ink	China guangdong panyu
26	mita	ink	Japan
27	Transcript	ceramic material	Taiwan

28	HOME	ceramic material	Japan

29	Fe-Ni-Mn	Alloy Invar, Section Steel	Taiwan

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory

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Business Type:

Manufacturer,Importer,Exporter,Seller 


Year Established:

1997 


Total Annual:

716277898-736287698


Employee Number:

2500~2768 


Ecer Certification：

Active Member 

Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...

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Reach Us
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
http://www.pcbboardservice.com/

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