Payment Terms | L/C, T/T, Western Union, MoneyGram |
Supply Ability | 20000K/pcs per month |
Delivery Time | 15-20day |
Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Product Areas | Industrial Products |
Material | Alumina CeramicsAL203 |
Line Width And Space | 5/6mil |
Aspect Ratio | 0.35mm |
Layer | 4-Layer Alumina Ceramics |
Surface Finishing | ENIG 4U" |
Provide PCB Information | Gberber, Production Requirements, MOQ Quantity |
Impedance Value | ± 10% |
conductivity | 5W |
E-Test | 100% |
Brand Name | China chao sheng |
Model Number | CSPCB1524 |
Certification | ISO/UL/RoHS/TS |
Place of Origin | Shenzhen, Guangdong, China |
View Detail Information
Explore similar products
DCB Ceramic PCB Multilayer Printed Circuit Board ENIG 4U" 1OZ Copper Thickness
1.60mm Plate Thickness Multilayer Printed Circuit Board Copper Based Material
Normal Single Sided Circuit Board Prototyping Service Aluminium Based ENIG 2U"
Aluminum Base Multilayer Printed Circuit Board , Small Printed Circuit Board 8
Product Specification
Payment Terms | L/C, T/T, Western Union, MoneyGram | Supply Ability | 20000K/pcs per month |
Delivery Time | 15-20day | Packaging Details | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
Product Areas | Industrial Products | Material | Alumina CeramicsAL203 |
Line Width And Space | 5/6mil | Aspect Ratio | 0.35mm |
Layer | 4-Layer Alumina Ceramics | Surface Finishing | ENIG 4U" |
Provide PCB Information | Gberber, Production Requirements, MOQ Quantity | Impedance Value | ± 10% |
conductivity | 5W | E-Test | 100% |
Brand Name | China chao sheng | Model Number | CSPCB1524 |
Certification | ISO/UL/RoHS/TS | Place of Origin | Shenzhen, Guangdong, China |
High Light | multilayer flexible pcb ,small printed circuit board |
Thermoelectric Separation Copper Based PCB PCB Ensure Benefit Of Choosing The Aluminum PCB For Major Usage alumina ceramicsAL203
Process structure: alumina ceramic 96%, thermal conductivity 3W
Surface treatment: Shenjin 4U "
chaosheng Circuits Co., Limited offers ceramic PCB for yourprinted circuit boards needs. Many users of printed circuit boards find ceramicPCBs have an advantage over traditional boards made of other materials. This is because they provide suitable substrates for electronic circuits that have a high thermal conductivity and a low expansion coefficient (CTE). The multilayer ceramic PCB is extremely versatile and can replace a complete traditional printed circuit board with a less complex design and increased performance. You can use them for high-power circuits, chip-on-board modules, proximity sensors and more.
chaosheng Thermal Conductivity, Low Expansion Ceramic PCB
Besides its enviable thermal properties and expansion coefficient, ceramic boards work at operating temperatures up to 350 degrees Celsius, create a smaller package size, offer better high-frequency performance and can come in hermetic packages for no water absorption. Using ceramic PCBs can also result in a lower overall system cost and be especially cost-effective for dense packages, since you have parallel processing of layers.
Use Ceramic PCB to Increase the Performance of Electronic Circuits
It is important to choose the highly appropriate substrates for your electronic circuits. There are different kinds of boards available, but ceramic pcb get more fame among circuit board users because of its versatility. If you want to get the best kinds of boards, you can hire us. We offer the most reliable solutions based on the printed circuit boards requirements of our clients. The main reason to use these solutions is that they are ideal for all kinds of electronic circuits which have minimal expansion coefficient and increased thermal conductivity. With better versatility, it appears as a perfect alternative to existing printed circuit board boasting of increased performance and minimal complex design. It ensures that ceramic pcb work effectively on chip-on-board modules, high-power circuits, and proximity sensors.
Enjoy better thermal conductivity
The specialized thing about our solutions is that they are well-equipped with enviable expansion coefficient and thermal properties. Apart from that, they are working at the operating temperatures of roughly about 350 degrees Celsius. It not only creates a compact package size but also provide an increased level of frequency performance. With ceramic pcb, you can reduce the system cost. It is because we offer the finest range of solutions at very cost-effective rates. If you desire to collect more useful information about our solutions, you can visit our official portal. It is the right place where you can look at our product details before making any decision.
according to your test procedure.
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Our Service
PCB, FPC process production capability
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
Technicalltem | Mass Product | Advanced Technolgy | |||||
2017year | 2018year | 2019year | |||||
Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
Multi-layer overlay | N+N | N+N | N+N | ||||
N+X+N | N+X+N | N+X+N | |||||
sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole |
PCB, FPC main material supplier
NO | supplier | Supply material name | Material origin | |||||
1 | Japan | High frequency materials, PI, covering membrane,Copper berth | Mitsubishi Japan | |||||
2 | dupont | High frequency materials, PI, covering film, dry film,Copper berth | Japan | |||||
3 | panasonic | High frequency materials, PI, covering membrane,Copper berth | Japan | |||||
4 | SanTie | PI, covering membrane | Japan | |||||
5 | Born good | FR-4,PI,PP,Copper berth | shenzhen, China | |||||
6 | A rainbow | PI, covering membrane,Copper berth | Taiwan | |||||
7 | teflon | High frequency materials | The United States | |||||
8 | Rogers | High frequency materials | The United States | |||||
9 | Nippon Steel | PI, covering membrane,Copper berth | Taiwan | |||||
10 | sanyo | PI, covering membrane,Copper berth | Japan | |||||
11 | South Asia | FR-4,PI,PP,Copper berth | Taiwan | |||||
12 | doosan | FR-4,PP | South Korea | |||||
13 | Tai Yao plate | FR-4,PP,Copper berth | Taiwan | |||||
14 | Alight | FR-4,PP,Copper berth | Taiwan | |||||
15 | Yaoguang | FR-4,PP,Copper berth | Taiwan | |||||
16 | Yalong | FR-4,PP | The United States | |||||
17 | ISOAL | FR-4,PP | Japan | |||||
18 | OAK | Buried, buried resistance, PP | Japan | |||||
19 | United States 3M | FR-4,PP | The United States | |||||
20 | Bergs | Copper and aluminum matrix | Japan | |||||
21 | The sun | ink | Taiwan | |||||
22 | Murata | ink | Japan | |||||
23 | generous andbenevolent | PI, covering membrane,Copper berth | China's jiangxi | |||||
24 | Yasen | PPI, covering membrane | China jiangsu | |||||
25 | Yong Sheng Tai | ink | China guangdong panyu | |||||
26 | mita | ink | Japan | |||||
27 | Transcript | ceramic material | Taiwan | |||||
28 | HOME | ceramic material | Japan | |||||
29 | Fe-Ni-Mn | Alloy Invar, Section Steel | Taiwan | |||||
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
716277898-736287698
Employee Number:
2500~2768
Ecer Certification:
Active Member
Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...
Get in touch with us
Leave a Message, we will call you back quickly!