Shenzhen Lefang Electronics Co., Ltd
| Payment Terms | T/T, Western Union, Paypal |
| Supply Ability | 290, 000sqm Per Month |
| Delivery Time | 2-10 work days |
| Packaging Details | Inner: Vacuum Packing; Dry Packing out Packing |
| Base Material/ Dielectric | fr - 4 |
| Layer | 8 Layers |
| Surface treatment | Immersion gold |
| Board thickness | 1.0 mm |
| Solder Mask | blue |
| Min. Aperture | 0.1 mm |
| Line Width/Spacing | 0.1 / 0.075 mm |
| Size | 40 * 90 mm |
| Copper Thickness | 70 um / 2 OZ |
| Brand Name | LEFANG |
| Model Number | OT6008L365 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
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Product Specification
| Payment Terms | T/T, Western Union, Paypal | Supply Ability | 290, 000sqm Per Month |
| Delivery Time | 2-10 work days | Packaging Details | Inner: Vacuum Packing; Dry Packing out Packing |
| Base Material/ Dielectric | fr - 4 | Layer | 8 Layers |
| Surface treatment | Immersion gold | Board thickness | 1.0 mm |
| Solder Mask | blue | Min. Aperture | 0.1 mm |
| Line Width/Spacing | 0.1 / 0.075 mm | Size | 40 * 90 mm |
| Copper Thickness | 70 um / 2 OZ | Brand Name | LEFANG |
| Model Number | OT6008L365 | Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China | ||
| High Light | copper clad printed circuit board ，through hole pcb | ||
8 Layers 1.0mm ENIG Blue Solder Heavy Copper PCB Printed Circuit Board
The 8 layers thick copper PCB Board is made with FR4 Board material with 2 Oz / 70 µm copper thickness. Also, the board size of this high frequency PCB Board is 40 * 90 mm, with blue solder mask and OSP surface treatment.
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
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Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others |
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| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
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If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
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SAMPLE:
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| Item | Details |
| Max layer count | 20 L |
| Max board thickness | 6.0 mm |
| Max aspect ratio | 10 : 1 |
| Max copper thickness | 6 OZ |
| Max dimension | 600 * 700mm |
| Min thickness of 4 layers PCB | 0.4 mm |
| Min hole / pad | 0.15 / 0.35mm |
| Hole location accuracy | + / - 0.05mm |
| PTH hole tolerance | + / - 0.05mm |
| Min line width and line space | 0.065 / 0.065mm |
| Surface treatment |
HASL / HASL lead free, OSP
Immersion gold/silver/tin, gold plating (hard gold and soft gold),
silver plating, tin plating, platinum plating, carbon ink,
ENEPIG (electroless nickel - electroless palladium - immersion gold) |
Lead Time
| Layer count | Sample lead time/workday | Batch lead time/workday |
| 1-2L | 2 | 6 |
| 4L | 5 | 8 |
| 6L | 5 | 9 |
| 8L | 6 | 10 |
| 10L | 8 | 10 |
| 12L | 8 | 12 |
| 14L | 10 | 15 |
| 16L | 10 | 18 |
| 18-40L (Up to difficulty) | at least 18 | at least 24 |
| P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays | ||
-- What LEFANG's vision is to Make Our Customer's Products Better, so we try our best to fulfill the quality control
system andenvironmental management system. Our approved certification are as below:
| ISO9001:2008 | ISO14001:2004 |
| ISO/TS16949:2009 | OHSAS18000 |
| UL | RoHS |
| QC080000 | CQC |
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Employee Number:
100~120
Ecer Certification：
Active Member
Established in 1999, we own 3 modern factories in China. Guangdong province - Shenzhen PCB Factory and Dongguan PCB Factory. The total production capacity is 290,000 sqm/month. Our main product is high precision multilayer circuit board. Also we are ex... Established in 1999, we own 3 modern factories in China. Guangdong province - Shenzhen PCB Factory and Dongguan PCB Factory. The total production capacity is 290,000 sqm/month. Our main product is high precision multilayer circuit board. Also we are ex...
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