Shenzhen Lefang Electronics Co., Ltd
| Payment Terms | T/T, Western Union, Paypal |
| Supply Ability | 290, 000sqm Per Month |
| Delivery Time | 2-10 work days |
| Packaging Details | Inner: Vacuum Packing; Dry Packing out Packing |
| Raw material | Aluminum Based |
| Layer count | 1 Layer |
| Board thickness | 1.0 MM |
| Copper thickness | 1 OZ / 35 µm |
| Surface treatment | Immersion Gold |
| Solder mask | White |
| Board size | 29 * 29 MM |
| Min. Aperture | 0.2 MM |
| Brand Name | LEFANG |
| Model Number | RM0001L162 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
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Product Specification
| Payment Terms | T/T, Western Union, Paypal | Supply Ability | 290, 000sqm Per Month |
| Delivery Time | 2-10 work days | Packaging Details | Inner: Vacuum Packing; Dry Packing out Packing |
| Raw material | Aluminum Based | Layer count | 1 Layer |
| Board thickness | 1.0 MM | Copper thickness | 1 OZ / 35 µm |
| Surface treatment | Immersion Gold | Solder mask | White |
| Board size | 29 * 29 MM | Min. Aperture | 0.2 MM |
| Brand Name | LEFANG | Model Number | RM0001L162 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 | Place of Origin | Shenzhen,China |
| High Light | single layer pcb board ，1 layer pcb | ||
1.0 MM Aluminum Single Sided PCB Circuit Board for LED Lighting with ENIG
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
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Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others |
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| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
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If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
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SAMPLE:
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No.
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Item
|
Data
|
| 1 | Layer count |
1-20 layers |
| 2 | Raw material type |
Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper
based, aluminum based |
| 3 | Raw material brand | Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc |
| 4 | Board thickness | 0.1-6.0mm |
| 5 | Max board size | 600 mm * 700 mm |
| 6 | Solder mask | Green, red, blue, black, white, yellow |
| 7 | Surface treatment |
HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating
(hard gold and soft gold), silver plating, tin plating, platinum plating,
carbon ink, and ENEPIG(electroless nickel - electroless palladium -
immersion gold) |
| 8 | Copper thickness | 0.05 Oz - 8 Oz (17 um-288 um ) |
| 9 | Min Line width /space | 0.065 mm / 0.065 mm |
| 10 | Finished hole size | 0.10 - 5.95 mm |
| 11 | Blind/buried via | 0.10 mm |
| 12 | Aspect ratio | 10:1 |
| 13 | PTH tolerance | + / - 0.05 mm |
| 14 | Hole location tolerance | + / - 0.05 mm |
| 15 | Impedance control tolerance | + / - 8% mm |
| 16 | Outline tolerance | + / - 0.10 mm |
| Layer count | Sample lead time/workday | Batch lead time/workday |
| 1-2L | 2 | 6 |
| 4L | 5 | 8 |
| 6L | 5 | 9 |
| 8L | 6 | 10 |
| 10L | 8 | 10 |
| 12L | 8 | 12 |
| 14L | 10 | 15 |
| 16L | 10 | 18 |
| 18-40L (Up to difficulty) | at least 18 | at least 24 |
|
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays |
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| Board Brand | ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc |
| Potion | Rohm & Haas, Atotech, Umicore |
| Printing Ink | Taiyo, Rongda |
| Dry Film | Asahi, Dupont, Etertec |
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Employee Number:
100~120
Ecer Certification：
Active Member
Established in 1999, we own 3 modern factories in China. Guangdong province - Shenzhen PCB Factory and Dongguan PCB Factory. The total production capacity is 290,000 sqm/month. Our main product is high precision multilayer circuit board. Also we are ex... Established in 1999, we own 3 modern factories in China. Guangdong province - Shenzhen PCB Factory and Dongguan PCB Factory. The total production capacity is 290,000 sqm/month. Our main product is high precision multilayer circuit board. Also we are ex...
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