Shenzhen Hansome Technology Co., Ltd.
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days |
| Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station |
| Warranty | 1 Year |
| Control | Touch screen |
| PLC | MITSUBISHI |
| Relay Brand | Schneider |
| Optoelectronic Switch | OMRON |
| Material | Aluminum Alloy |
| Condition | New |
| Thickness | 0.3 - 5mm |
| Signal | SMEMA |
| Application | Electronic Assembly |
| Color | Silver |
| Control System | PLC |
| OEM/ODM | Available |
| Total power | 2600W |
| Power Supply | AC220V |
| Air Pressure | 4-6bar |
| Mounting accuracy | ±0.01mm |
| Type | Automatic |
| Weight | 30KG |
| Brand Name | HSTECH |
| Model Number | HS-700 |
| Certification | CE |
| Place of Origin | China |
View Detail Information
Explore similar products
FIFO LIFO PCB Buffer Conveyor Machine With SMEMA Communication Interface
Automated PCB Inverter Machine Step Motor Flipper Handling Flexible Turnover
Stainless Steel PCB Handling Equipment Flexible Platform Magazine Loader
SMT production line anti-static belt type 90 degrees printed circuit board
Product Specification
| Payment Terms | T/T, Western Union, MoneyGram | Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days | Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station | Warranty | 1 Year |
| Control | Touch screen | PLC | MITSUBISHI |
| Relay Brand | Schneider | Optoelectronic Switch | OMRON |
| Material | Aluminum Alloy | Condition | New |
| Thickness | 0.3 - 5mm | Signal | SMEMA |
| Application | Electronic Assembly | Color | Silver |
| Control System | PLC | OEM/ODM | Available |
| Total power | 2600W | Power Supply | AC220V |
| Air Pressure | 4-6bar | Mounting accuracy | ±0.01mm |
| Type | Automatic | Weight | 30KG |
| Brand Name | HSTECH | Model Number | HS-700 |
| Certification | CE | Place of Origin | China |
High-precision CCD colour alignment system for PCB handling equipment
Introduction
BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of package chip.BGA is based on the ball grid array structure to enhance the characteristics of digital equipment to reduce the size of the product. BGA is based on the ball grid array structure to enhance the characteristics of digital devices and reduce the size of the product. All the digital devices based on this packaging technology have the same characteristics, that is, small size, strong features, low cost, powerful functions, BGA rework station is used to repair the BGA chip equipment.
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging
COMPANY PROFILE
Shenzhen Hansome Technology Co.,Ltd(HSTECH)is a professional professional SMT board handlingequipment(Loader,Unloader, Buffer, Conveyor,etc)manufacturer, We are a high-tech enterprise with independent intellectual propertyrights,the company is mainly engaged in the research and development, productionand sales of sMT/THT production line board handling equipment.We have professional technicians & sales,relies on high-tech and tries our best tosupply high efficient and reliable board handling to our customers. At the same time,our experienced engineering team always grasps smart factory's developing directionupdates the products and technical according to the market demand, pursuit to makemore automation and cost-effective product all the time, we also do the OEM basedon different needs of our customer.
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
Get in touch with us
Leave a Message, we will call you back quickly!