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Manufacturer of a wide range of products which include 4 Layers Multilayer Metal Core Pcb Network Server ODM With ENIG,700*480mm FPC Circuit Board HDI Type 3 N 3 Any Layer Layer 1-32L,Consumer Electronics Rigid Flex Circuit Boards...
MOQ:
Price:
Multi-Laminations | 4 Times |
Min. Line Width/Space | 0.05/0.05mm |
Max. Board thickness | 6.0mm |
Min. Core Thickness | 0.03mm |
Layer | 2-48L |
Back drill | 0.15mm |
Max. Board size | 1000*600mm |
Aspect Ratio | 20:1 |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Min flex width | 1.5mm |
Min board thickness-4L | 0.3mm |
Min copper thickness | 3OZ |
Layer | 1-32L |
Max. Board thickness | 5.0mm |
HDI type | 3+N+3 Any Layer |
Min trace width/space | 0.05/0.05 |
Max board size | 700*480mm |
Brand Name | Kingtech |
Model Number | FPC |
Place of Origin | China |
MOQ:
Price:
Min trace width/space | 0.05/0.05 |
HDI type | 3+N+3 Any Layer |
Min board thickness-4L | 0.3mm |
Min flex width | 1.5mm |
Max board size | 700*480mm |
Layer | 1-32L |
Min copper thickness | 3OZ |
Max. Board thickness | 5.0mm |
Brand Name | Kingtech |
Model Number | FPC |
Place of Origin | China |
MOQ:
Price:
Min. Line Width/Space | 0.05/0.05mm |
Max. Board size | 1000*600mm |
Min. Vias Hole Size | 0.15mm |
Max. Board thickness | 6.0mm |
Misalignment of layers | 0.1mm |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Aspect Ratio | 20:1 |
Layer | 2-48L |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Min. Vias Hole Size | 0.15mm |
Layer | 2-48L |
Min. PAD | 0.14mm For Inner Layer |
Max. Board thickness | 6.0mm |
Min. Core Thickness | 0.03mm |
Misalignment of layers | 0.1mm |
Aspect Ratio | 20:1 |
Multi-Laminations | 4 Times |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Multi-Laminations | 4 Times |
Max. Board thickness | 6.0mm |
Aspect Ratio | 20:1 |
Impedance Control | ±5% |
Misalignment of layers | 0.1mm |
Back drill | 0.15mm |
Max. Board size | 1000*600mm |
Min. Vias Hole Size | 0.15mm |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Min. Line Width/Space | 0.05/0.05mm |
Impedance Control | ±5% |
Min. Vias Hole Size | 0.15mm |
Misalignment of layers | 0.1mm |
Layer | 2-48L |
Min. PAD | 0.14mm For Inner Layer |
Back drill | 0.15mm |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Multi-Laminations | 4 Times |
Min. Core Thickness | 0.03mm |
Max. Board size | 1000*600mm |
Layer | 2-48L |
Impedance Control | ±5% |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Max. Board thickness | 6.0mm |
Aspect Ratio | 20:1 |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Min. Core Thickness | 0.03mm |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Misalignment of layers | 0.1mm |
Multi-Laminations | 4 Times |
Impedance Control | ±5% |
Min. PAD | 0.14mm For Inner Layer |
Max. Board thickness | 6.0mm |
Min. Line Width/Space | 0.05/0.05mm |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
MOQ:
Price:
Max. Board size | 1000*600mm |
Misalignment of layers | 0.1mm |
Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
Aspect Ratio | 20:1 |
Back drill | 0.15mm |
Min. PAD | 0.14mm For Inner Layer |
Min. Line Width/Space | 0.05/0.05mm |
Layer | 2-48L |
Brand Name | Kingtech |
Model Number | Multilayer |
Place of Origin | China |
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