Huizhou Xinghongtai Electronics Co., Ltd.
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100000pcs/day |
| Delivery Time | 5-8 day |
| Board Thickness | 0.2mm-6.0mm |
| Min. Line Width/Spacing | 0.1mm/0.1mm |
| Solder Mask Color | Green, Black, White, Blue, Red |
| Silkscreen Color | White, Black, Yellow |
| Min. Hole Size | 0.2mm |
| Dielectric Constant | 2.5-4.5 |
| Min. Silkscreen Bridge | 0.1mm |
| Material | Metal Core |
| Min. Solder Mask Bridge | 0.1mm |
| Layer Count | 1-4 Layers |
| Operating Temperature | -40°C to 150°C |
| Thermal Conductivity | 1.0-8.0 W/mK |
| Copper Thickness | 1oz-6oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Brand Name | XHT |
| Model Number | XHT-Metal Core PCB Manufacturing-2 |
| Certification | ISO、IATF16949、RoSH |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram | Supply Ability | 100000pcs/day |
| Delivery Time | 5-8 day | Board Thickness | 0.2mm-6.0mm |
| Min. Line Width/Spacing | 0.1mm/0.1mm | Solder Mask Color | Green, Black, White, Blue, Red |
| Silkscreen Color | White, Black, Yellow | Min. Hole Size | 0.2mm |
| Dielectric Constant | 2.5-4.5 | Min. Silkscreen Bridge | 0.1mm |
| Material | Metal Core | Min. Solder Mask Bridge | 0.1mm |
| Layer Count | 1-4 Layers | Operating Temperature | -40°C to 150°C |
| Thermal Conductivity | 1.0-8.0 W/mK | Copper Thickness | 1oz-6oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin | Brand Name | XHT |
| Model Number | XHT-Metal Core PCB Manufacturing-2 | Certification | ISO、IATF16949、RoSH |
| Place of Origin | China | ||
| High Light | High Effective PCB Board Assembly ，220V PCB Board Assembly ，DOB Led Light Metal Core PCB | ||
LED Aluminum Substrate PCB Board Fabrication Metal Core PCB Manufacturer
PCB manufacturer in china
we produced lots of metal core pcbs in our manufacturing factory, include aluminum and copper core pcbs.
Our company has first-class PCB manufacturing capabilities and provides customers with high-quality, high-performance printed circuit boards. We have advanced production equipment and technical teams to meet customers’ needs for various complex PCBs.
First, we have advanced production equipment. Our factory is equipped with the latest PCB production lines, these devices can accurately realize customers’ PCB design requirements and ensure product quality and stability.
Secondly, we have a professional technical team. Our team of engineers has extensive experience in PCB design and manufacturing and is able to provide customers with a full range of technical support. Whether in the PCB design stage or during the manufacturing process, we are able to provide customers with professional advice and solutions to ensure that the product can achieve optimal performance and reliability.
In addition, we also focus on quality management. We strictly follow international quality management system standards to ensure that every PCB meets customer requirements and standards. We use advanced testing equipment and strict quality control processes to conduct comprehensive testing and verification of each PCB to ensure product quality and stability.
Finally, we are able to meet our customers’ needs for various complex PCBs. Whether it is a single-layer, double-layer or multi-layer PCB, whether it is a rigid, flexible or rigid-flexible PCB, we are able to provide customers with high-quality customized solutions. We can also meet customers’ PCB manufacturing needs for special process requirements, such as blind and buried vias, controlled impedance, special materials, etc.
In short, we have strong PCB manufacturing capabilities and are able to provide customers with high-quality, high-performance printed circuit boards. We will continue to invest more resources and energy to continuously improve our manufacturing capabilities and provide customers with better products and services.
| Process | Item | Process Capability | |
| Base Information | Production Capability | Layer count | 1-30 layers |
| Bow and twist | 0.75% standard, 0.5% advanced | ||
| Min. finished PCB size | 10 x 10mm(0.4 x 0.4") | ||
| Max. finished PCB size | 530 x 1000mm(20.9 x 47.24 ") | ||
| Multi-press for blind/buried vias | Multi-press Cycle≤3 times | ||
| Finished board thickness | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Finished board thickness tolerance | +/-10% standard, +/-0.1mm advanced | ||
| Surface finish | HASL, Lead free HASL, Flash gold, ENIG, Hard gold plating, OSP, Immersion Tin, Immersion silver, etc | ||
| Selective surface finish | ENIG+Gold finger, Flash gold+Gold finger | ||
| Material Type | FR4, Aluminum, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, etc. | Also can buy the materials as request | |
| Copper foil | 1/3oz ~ 10oz | ||
| Prepreg Type | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, etc.. | |
| Reliable Test | Peel strength | 7.8N/cm | |
| Fammability | 94V-0 | ||
| Ionic contamination | ≤1ug/cm² | ||
| Min. dielectric thickness | 0.075mm(3mil) | ||
| Impedance tolerance | +/-10%, min can control +/- 7% | ||
| Inner layer&Outer layer Image Transfer | Machine Capability | Scrubbing Machine | Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Material size: min. 177 x 177mm(7 x 7") | |||
| Inner layer Process Capability | Min. inner line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Min. inner layer annular ring | 0.1mm(4mil) | ||
| Min. inner layer isolation clearance | 0.25mm(10mil) standard, 0.2mm(8mil) advanced | ||
| Min. spacing from board edge to conductive | 0.2mm(8mil) | ||
| Min. gap width between copper ground | 0.127mm(5mil) | ||
| Unbalance copper thickness for inner core | H/1oz, 1/2oz | ||
| Max. finished copper thickness | 10oz | ||
| Outer layer Process Capability | Min. outer line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. hole pad size | 0.3mm(12mil) | ||
| Process Capability | Max. slot tenting size | 5 x 3mm(196.8 x 118mil) | |
| Max. tenting hole size | 4.5mm(177.2mil) | ||
| Min. tenting land width | 0.2mm(8mil) | ||
| Min. annular ring | 0.1mm(4mil) | ||
| Min. BGA pitch | 0.5mm(20mil) | ||
| AOI | Machine Capability | Orbotech SK-75 AOI | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
| Orbotech Ves Machine | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
| Drilling | Machine Capability | MT-CNC2600 Drill machine | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Material size: max. 470 ~ 660mm(18.5 x 26") | |||
| Min. drill size: 0.2mm(8mil) | |||
| Process Capability | Min. multi-hit drill bit size | 0.55mm(21.6mil) | |
| Max. aspect ratio(finished board size VS Drill size) | 12:01 | ||
| Hole location tolerance(compared with CAD) | +/-3mil | ||
| Counterbore hole | PTH&NPTH, Top angle 130°,Top diameter <6.3mm | ||
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Max. drill bit size | 6.5mm(256mil) | ||
| Min. multi-hit slot size | 0.45mm(17.7mil) | ||
| Hole size tolerance for press fit | +/-0.05mm(+/-2mil) | ||
| Min. PTH slot size tolerance | +/-0.15mm(+/-6mil) | ||
| Min. NPTH slot size tolerance | +/-2mm(+/-78.7mil) | ||
| Min. spacing from hole edge to conductive(Blind vias) | 0.23mm(9mil) | ||
| Min. laser drill size | 0.1mm(+/-4mil) | ||
| Countersink hole angle&Diameter | Top 82,90,120° | ||
| Wet Process | Machine Capability | Panel&Pattern plating line | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) |
| Material size: max. 610 x 762mm(24 x 30") | |||
| Deburring Maching | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Material size: min. 203 x 203mm(8" x 8") | |||
| Desmear Line | Material thickness: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
| Tin plating line | Material thickness: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
| Process Capability | Hole wall copper thickness | average 25um(1mil) standard | |
| Finished copper thickness | ≥18um(0.7mil) | ||
| Min line width for etching marking | 0.2mm(8mil)) | ||
| Max.finished copper weight for inner&outer layers | 7oz | ||
| Different copper thickness | H/1oz,1/2oz | ||
| Solder Mask& Silkscreen | Machine Capability | Scrubbing Machine | Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Exposer | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: max. 635 x 813mm(25 x 32") | |||
| Develop machine | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: min. 101 x 127mm(4 x 5") | |||
| Color | Solder mask color | Green, matte green, yellow, black, blue, red, white | |
| Silkscreen color | White, yellow, black, blue | ||
| Solder Mask Capability | Min. solder mask opening | 0.05mm(2mil) | |
| Max. plugged via size | 0.65mm(25.6mil) | ||
| Min. width for line coverage by S/M | 0.05mm(2mil) | ||
| Min. solder mask legends width | 0.2mm(8mil) standard, 0.17mm(7mil) advanced | ||
| Min. solder mask thickness | 10um(0.4mil) | ||
| Solder mask thickness for via tenting | 10um(0.4mil) | ||
| Min. carbon oil line width/spacing | 0.25/0.35mm(10/14mil) | ||
| Min. tracer of carbon | 0.06mm(2.5mil) | ||
| Min. carbon oil line trace | 0.3mm(12mil)) | ||
| Min. spacing from carbon pattern to pads | 0.25mm(10mil) | ||
| Min. width for peelable mask cover line/pad | 0.15mm(6mil) | ||
| Min. solder mask bridge width | 0.1mm(4mil)) | ||
| Solder mask Hardness | 6H | ||
| Peelable Mask Capability | Min. spacing from peelable mask pattern to pad | 0.3mm(12mil)) | |
| Max. size for peelable mask tent hole(By screen printing) | 2mm(7.8mil) | ||
| Max. size for peelable mask tent hole(By aluminum printing) | 4.5mm | ||
| Peelable mask thickness | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Silkscreen Capability | Min. silkscreen line width | 0.11mm(4.5mil) | |
| Min. silkscreen line height | 0.58mm(23mil) | ||
| Min. spacing from legend to pad | 0.17mm(7mil) | ||
| Surface Finish | Surface Finish Capability | Max. gold finger length | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold | ||
| gold finger | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL Machine | Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Hard gold plating | 1-5u" | ||
| Immersion Tin | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Immersion Silver | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| E-Test | Machine Capability | Flying probe tester | Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Material size: max. 498 x 597mm(19.6 ~ 23.5") | |||
| Min. spacing from test pad to board edge | 0.5mm(20mil) | ||
| Min. conductive resistance | 5Ω | ||
| Max. insulation resistance | 250mΩ | ||
| Max. test voltage | 500V | ||
| Min. test pad size | 0.15mm(6mil)) | ||
| Min. test pad to pad spacing | 0.25mm(10mil) | ||
| Max. test current | 200mA | ||
| Profiling | Machine Capability | Profiling type | NC routing, V-cut, slot tabs, stamp hole |
| NC routing machine | Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Material size: max. 546 x 648mm(21.5 x 25.5") | |||
| V-cut machine | Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Max material width for V-cut: 457mm(18") | |||
| Process Capability | Min. routing bit size | 0.6mm(23.6mil) | |
| Min. outline tolerance | +/-0.1mm(+/-4mil) | ||
| V-cut angle type | 20°, 30°, 45°, 60° | ||
| V-cut angle tolerance | +/-5° | ||
| V-cut registration tolerance | +/-0.1mm(+/-4mil ) | ||
| Min. gold finger spacing | +/-0.15mm(+/-6mil) | ||
| Bevelling angle tolerance | +/-5° | ||
| Bevelling remain thickness tolerance | +/-0.127mm(+/-5mil) | ||
| Min. inner radius | 0.4mm(15.7mil) | ||
| Min. spacing from conductive to outline | 0.2mm(8mil) | ||
| Countersink/Counterbore depth tolerance | +/-0.1mm(+/-4mil) | ||
We have a strong electronic component supply chain, we can offer competitive price for your BOM list.
We specialize in providing comprehensive EMS solutions to meet the unique needs of our clients.
Company Details
Business Type:
Manufacturer
Year Established:
2004
Total Annual:
10000000-20000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Our company established in 2004, has become a trusted name in the EMS industry, strategically located in Huizhou, Guangdong province, near the bustling hub of Shenzhen. With a landscape of 20,000 square meters, our facilities are equipped to cater to a diverse range of customers ac... Our company established in 2004, has become a trusted name in the EMS industry, strategically located in Huizhou, Guangdong province, near the bustling hub of Shenzhen. With a landscape of 20,000 square meters, our facilities are equipped to cater to a diverse range of customers ac...
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