Quanhong FASTPCB
| Supply Ability | 10PCS+48Hour(production time ) |
| Packaging Details | Corrugated case |
| PCB | P3 LED display printed circuit board |
| Base Material | FR-4 TG170 |
| Number Of Layers | 6 Layer |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.20mm |
| Min. Line Width | 0.075mm |
| Min. Line Spacing | 0.075mm |
| Solder Mask Color | Black |
| Surface Treatment | Immersion Gold |
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Product Specification
| Supply Ability | 10PCS+48Hour(production time ) | Packaging Details | Corrugated case |
| PCB | P3 LED display printed circuit board | Base Material | FR-4 TG170 |
| Number Of Layers | 6 Layer | Board Thickness | 1.6mm |
| Min. Hole Size | 0.20mm | Min. Line Width | 0.075mm |
| Min. Line Spacing | 0.075mm | Solder Mask Color | Black |
| Surface Treatment | Immersion Gold | ||
| High Light | P3 Led Display Circuit Board ，display flex pcb ，display module pcb | ||
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 | |
| Min. 12L | 0.65 | 0.6 | 0.55 | |
| MAX. | 2.4 | |||
| Min. Core Thickness ( um ) | 50 | 40 | 40 | |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 | |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Max Panel Width (inch) | 25 | 25 | 25 | |
| Max Panel Length (inch) | 29 | 29 | 29 | |
| Max Layer Count (L) | 16 | 18 | 36 | |
| Max Board thickness (mm) | 3.2 | 4 | 6 | |
| Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
| Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
| Outer Layer ( OZ ) | 2 | 3 | 4 | |
| Min DHS ( mm ) | 0.2 | 0.15 | 0.15 | |
| PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
| Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
| Max. AR | 12:1 | 16:1 | 20:1 | |
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
| Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
| Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
| <50ohms | 5 Ω | 5 Ω | 4 Ω | |
| Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
| Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
| Max dimple for POFV ( um ) | 30 | 20 | 15 | |
| Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
| Packaging & Delivery | |||||
| Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. | ||||
| Port: | Shenzhen or Hongkong | ||||
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 20 | 21 | 25 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller,Other
Year Established:
2007
Total Annual:
12000000-15000000
Employee Number:
100~200
Ecer Certification：
Active Member
Shenzhen Quanhong electronics Co., Ltd. is a professional manufacturer of high-precision double-sided, multi-layer circuit board and aluminum substrate. The factory is located in the complex and difficult allegro, sample and small and medium batch one-stop service, to help customers create more valu... Shenzhen Quanhong electronics Co., Ltd. is a professional manufacturer of high-precision double-sided, multi-layer circuit board and aluminum substrate. The factory is located in the complex and difficult allegro, sample and small and medium batch one-stop service, to help customers create more valu...
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