Metal Core Multilayer PCB Circuit Board With Rohs Certificate

Product Specification

shenzhen customized pcba assembly Printed Circuit Board with Rohs Multilayer PCB

What is Multilayer PCBs

As multilayer PCBs can accommodate more electronic components, they have been widely used in modern-day electrical appliances with variants ranging from four to twelve layers. Several applications, such as smart devices require between four to eight layers, while smartphones can use up to twelve layers. While manufacturing multilayer PCBs, designers choose an even number of layers over odd as laminating an odd number of layers can make the circuit complex and also result in high cost.

It is a type of PCB which comes with a combination of single sided PCB and double sided PCB.

It features layers more than double sided PCB.

How do multilayer PCBs work?

In a multilayer PCB design, the designer needs to dedicate one layer to a ground plane and another to the power plane. For digital-only PCBs, the designer can also dedicate the entire power layer and if there is space on the top and bottom layer, that can be used to route any additional power rail tracks. The power layers are always in the middle of the board with the ground closer to the top layer. Once the power is taken care of on the inner layers, the remaining space is available for signal tracks that are routing. For example, in a six-layer stack up, there will be four signal routing layers and two layers dedicated to power.

Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board.

Are indentations created in the form of semi-plated holes on the edges of the PCB boards.

These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.

Parameters

• Layers: 10L multilayer pcb
• Board Thinkness:2.0mm
• Base Material:S1000-2 High tg
• Min Holes:0.2mm
• Minimum Line Width/Clearance:0.25mm/0.25mm
• Minimum Clearance between Inner Layer PTH to Line: 0.2mm
• Size:250.6mm×180.5mm
• Aspect Ratio:10 : 1
• Surface treatment:ENIG+ Selective hard gold
• Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
• Applications: Wi-Fi modules

FQA

1. What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.

2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure.

The most common alloying elements used in hard gold plating are cobalt, nickel or iron.

3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.

Grain sizes are about 60 times larger with ENIG plating, and hardness runs between 20 and 100 HK25.

ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.

A popular trend among manufacturers is board-to-board soldering.

This technique allows companies to produce integrated modules (often containing dozens of parts) on a single board that can be built into another assembly during production.

One easy way to produce a PCB that is destined to be mounted to another PCB is to create castellated mounting holes.

These are also known as "castellated vias" or "castellations."