Huashengxin Circuit Limited
Products
Manufacturer of a wide range of products which include Lead Free Assembly Material Rigid Flex Board with good reliability,4 Layer HDI Rigid Flex PCB Board Immersion Gold 4mil Green Solder Mask,4 Layers FR4 HDI high density interco...
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | 5-8 days |
| Packaging Details | vacuum |
| Brand Name | Huashengxin |
| Model Number | PCB |
| Certification | UL,ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Layer | 4L Flexible Rigid PCB |
| Material | FR-4+PI |
| Board Layer | 4L |
| Surface finished | Immersion gold |
| Board thickness | 1.6mm |
| Copper thickness | 1/1/1/1oz finished |
| Min. hole size | 0.3mm |
| Min.PCB track/gap: | 4mil/4mil |
| Solder mask | Green color TAIYO |
| Application | Digital products |
| Brand Name | Huashengxin |
| Model Number | 211912 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price: 0.1usd per pcs
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100000pcs per month |
| Delivery Time | 3-7days |
| Packaging Details | Anti-static Bag |
| Board Layer | 4L |
| Material | FR4 TG135 |
| Surface Treatment | ENIG |
| Finished Copper Thickness | 1/1/1/1oz |
| Solder mask | Green |
| Silkscreen | White |
| Brand Name | HSX Circuit |
| Model Number | NA |
| Certification | IATF16949-2016 | ISO9001 2015 | ZPMV2.E509426 | ROHS |
| Place of Origin | Shenzhen China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | 7-12 days |
| Packaging Details | vacuum |
| Brand Name | Huashengxin |
| Model Number | HDI PCB |
| Certification | ISO9001,UL,Reach,IATF16949 |
| Place of Origin | China |
MOQ: 1pcs
Price: Usd0.1 per piece
| Payment Terms | T/T, T/T, MoneyGram |
| Supply Ability | 100000pcs per month |
| Delivery Time | 3-7days |
| Packaging Details | Anti-static Bag |
| Layers | 12L |
| Material | FR4 |
| Outer Finished Copper Thickness | 1oz |
| Inner Finished Copper Thickness | 1oz |
| Surface Treatment | ENIG |
| Application | Medical device |
| Solder Mask | Green |
| Silkscreen | White |
| Brand Name | HSX Circuit |
| Model Number | HSX6656 |
| Certification | IATF16949-2016 | ISO9001 2015 | ZPMV2.E509426 | ROHS |
| Place of Origin | Shenzhen China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 4L 1+N+1 HDI Printed Circuit Board |
| Marterial | FR4 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 0.8mm |
| Copper thickness | 1/1/1/1OZ |
| Min.PCB track/gap: | 4/4mil |
| Solder mask | Green, two sides |
| Smallest Mechanical drilling hole: | 0.4mm |
| Special requirement | resin filled and plated over/0.25mm BGA/high TG |
| Applicationcommunications products | Communications |
| Brand Name | Huashengxin |
| Model Number | 135470 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 4L 1+N+1 High-Density Interconnector PCB |
| Marterial | FR4 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 2.0mm |
| Copper thickness | 1/1/1/1OZ |
| Min.PCB track/gap: | 4/4mil |
| Solder mask | Green, two sides |
| Smallest Mechanical drilling hole: | 0.2mm |
| Special requirement | impedance control/high TG |
| Applicationcommunications products | Communications products |
| Brand Name | Huashengxin |
| Model Number | 135464 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 8L 3+N+3 HDI Printed Circuit Boards |
| Marterial | FR4 TG150 |
| Surface finished | Immersion gold |
| Board Thickness | 1.6mm |
| Copper thickness | 1/1/1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 3/3mil |
| Solder mask | Blue |
| Smallest Mechanical drilling hole: | 0.2mm |
| Special request | Small line space and gap:3/3mil/ three step stack up |
| Applicationcommunications products | Digital products |
| Brand Name | Huashengxin |
| Model Number | 135419 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 6L 2+N+2 HDI Printed Circuit Boards |
| Marterial | FR4 TG170 S1000-2 |
| Surface finished | Immersion gold |
| Board Thickness | 1.6mm |
| Copper thickness | 1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 3/4mil |
| Solder mask | Green |
| Smallest Mechanical drilling hole: | 0.15mm |
| Special request | impedance control/0.25mm BGA |
| Applicationcommunications products | HDI Buried vias and blind vias, two step stack up /impedance control/resin filled |
| Brand Name | Huashengxin |
| Model Number | 135416 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
| Packaging Details | vacuum |
| PCB Name | 6L 1+N+1HDI Boards |
| Marterial | FR4 S1000-2 TG170 |
| Surface finished | Immersion gold |
| Board Thickness | 1.2mm |
| Copper thickness | 1/1/1/1/1/1OZ |
| Min.PCB track/gap: | 6/4mil |
| Solder mask | TAIYO Green |
| Smallest Mechanical drilling hole: | 0.25mm |
| Special request | HDI Buried vias and blind vias, one step stack up |
| Applicationcommunications products | communications products |
| Brand Name | Huashengxin |
| Model Number | 135033 |
| Certification | UL , ISO9001 |
| Place of Origin | China |
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