Payment Terms | T/T |
Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
Packaging Details | vacuum |
PCB Layer | Double Sided Flexible Circuits |
Material | PI |
Board Layer | 2L |
Finished treatment | ENIG |
Copper thickness | 1oz |
Minimum drilling size | 0.1mm |
Brand Name | Huashengxin |
Model Number | ED9A8099 |
Certification | UL , ISO9001 |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Delivery Time | fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production |
Packaging Details | vacuum | PCB Layer | Double Sided Flexible Circuits |
Material | PI | Board Layer | 2L |
Finished treatment | ENIG | Copper thickness | 1oz |
Minimum drilling size | 0.1mm | Brand Name | Huashengxin |
Model Number | ED9A8099 | Certification | UL , ISO9001 |
Place of Origin | China | ||
High Light | 1oz Double Sided Flex PCB Board ,3mil Double Sided Flex PCB Board ,3mil flex pcb fabrication |
Polymer Film Flex PCB Board Double Sided 3mil 1oz ENIG Finished
Flex PCB Board Polymer Film Pcb Sourcing PCB Manufacturing Electronics PCB Components Assembly Rohs Compliant PCB
Double Sided Flexible Circuits
Flexible circuits (also called as flex circuits, flexible printed circuit boards, flex PCB, etc) are consisted of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since long long time ago. It is now one of the most important interconnection technologies in use for the manufacture of many advanced electronic products.
In practice there are many different kinds of flexible circuits, including one metal layer, double sided, multilayer and rigid flex circuits. The circuits can be formed by etching metal foil cladding (normally of copper) from polymer bases, plating metal or printing of conductive inks among other processes.
Advantage:
1) Accuracy of designs. Most of the advanced electronic devices in use today use flexible circuit boards because of the high level of precision expected of them.
2) They are lightweight. The circuit boards can be folded easily, thus they can be positioned in compartments.
3) Long-term performance. The superior qualities of flexible circuit boards allow them to have durability and long-term performance. The characteristics of low ductility and mass contained in these boards allow them to overcome the influence of vibrations, therefore giving them the capacity to have improved performance.
4) Heat dissipation. Because of the compact designs of the circuit board, there are shorter thermal paths generated and the dissipation of heat is faster compared to other kind of PCBs.
5) Flexibility. Due to their ability to be flexible, it is easily to bend flexible circuit boards to various levels when installing them, thus make it possible to enhance the functionality levels of various electronics.
FPC Technology Capability | |||
Attribute (All dimensions are mils unless otherwise specified) | Mass Production (Yield≥ 80%,Cpk≥1.33) | Small Amount(Yield≥60%, Key Specification Yield≥80% | Sample |
FPC(yes/no) | yes | yes | yes |
Layer count/Structure, Max. | 2 | 4 | 6 |
Size(L×W), Max. | 550mm*250mm | 550mm*250mm | 700mm*250mm |
Nominal thickness (mm) | 0.1~0.5 | 0.1~0.5 | 0.1~0.8 |
Thickness tolerance | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) |
Surface finish type | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold |
Soft ENIG(yes/no) | no | no | no |
Base material type | PI | PI | PILCPTK |
Coverlay thickness (um) | 28/50/60/80 | 28/50/60/80 | 28/50/60/80 |
Adhesive thickness (um) | 25/40/50/65 | 25/40/50/65 | 25/40/50/65 |
Copper thickness, Min./Max. (um) | 12-70 | 12-70 | 12-70 |
Base material thickness, Min./Max. (um) | 25-75 | 25-75 | 25-100 |
Mechanical drilled thru-hole size (DHS), Min. | 0.15 | 0.15 | 0.15 |
Plating aspect ratio, Max. | 3:1 | 3:1 | 5:1 |
Pad size, Min. | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.4mm Without through hole:0.2mm | With through hole:0.3mm Without through hole:0.2mm |
Pad size tolerance | 20% | 20% | 10% |
Pad to pad space, Min. | 4mil | 4mil | 4mil |
Pad to outline tolerance | ±3mil | ±3mil | ±2mil |
Pattern location accurancy | ±3mil | ±3mil | ±2mil |
Pattern location accurancy from top side to bottom | ±3mil | ±3mil | ±2mil |
Laser via hole diameter/pad, Min. | 4/12mil | 4/10mil | 4/10mil |
Outerlayer(Hoz+plating) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Innerlayer(Hoz) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
Inner line width tolerance | ±10% | ±10% | ±10% |
Outerlayer registration, Min. (Pad diameter = DHS + X) | DHS + 8 | DHS + 8 | DHS + 6 |
Innerlayer registration, Min. (Pad diameter = DHS + X)(L≤4 layer) | DHS + 10 | DHS + 10 | DHS + 8 |
Laser via hole pitch, Min. | 0.40mm | 0.40mm | 0.35mm |
Mechanical hole pitch, Min. | 0.50mm | 0.50mm | 0.40mm |
Drilled hole position tolerance | ±2mil | ±2mil | ±2mil |
Hole size tolerance | ±2mil | ±2mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to pad | ±3mil | ±3mil | ±2mil |
Location accurancy from tooling hole(PTH&NPTH) to outline | ±3mil | ±3mil | ±2mil |
Outline size tolerance | ±2mil | ±2mil | ±2mil |
LPI registration/dam, Min. | 2mil/4mil | 2mil/4mil | 2mil/3mil |
LPI dam on CVL | 8mil | 8mil | 8mil |
Coverlay open window/dam | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | Φ0.3mm/0.2mm |
Coverlay registration/Resin flow | 4mil | 4mil | 2mil |
Stifferness material | FR4/PI/Steel | FR4/PI/Steel | FR4/PI/Steel |
Stifferness dam, Min. | 12mil | 12mil | 8mil |
Stifferness registration/Resin flow | 8mil/4mil | 8mil/4mil | 4mil/2mil |
Impedance tolerance | 10% | 10% | 5% |
Thermal reliability(LPI, FCCL, CVL) | 288°/10s/3times | 288°/10s/3times | 288°/10s/3times |
Qualified material and structure UL | PI | PI | PI |
FAQ:
Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.
Q2:How about your PCB factory production capacity?
A: Our monthly production capacity is 50,000 square meter/month and 5000types/month.
Q3:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.
Q4:How will you usually ship the PCB?
A: Usually for small packages, we will ship the boards by DHL,UPS,FedEx door to door service, we could use your shipping account to do collection or use our account to ship in DDU (import duty unpaid) delivery term.
For heavy goods more than 300kg, we may ship your PCB boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.
Q5:What is your standard lead time for production?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days
Company Details
Business Type:
Manufacturer
Year Established:
2010
Total Annual:
50000000-65000000
Employee Number:
200~500
Ecer Certification:
Verified Supplier
Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board... Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Board...
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