Beijing Haina Lean Technology Co., Ltd
| Payment Terms | T/T, Western Union, L/C, MoneyGram |
| Supply Ability | 10,000,000 Point /Day |
| Delivery Time | 1-7days |
| Packaging Details | ESD packaging with carton box |
| Product name | HDI PCB Board |
| Material | FR4, 94v0 Circuit Board |
| Copper thickness | 1OZ |
| Min. line spacing/width | 0.1＊0.1mm |
| Min. hole size | Laser 0.05mm ; Mechnical 0.15mm |
| Service | One-stop Service,PCB&PCBA,ODM and OEM |
| PCB Assembly method | Mixed, SMT, and THT |
| Board thickness | 1.6mm |
| DK | 3.6 |
| surface treatment | ENIG |
| Brand Name | HNL-PCBA |
| Model Number | PCB Assembly 08 |
| Certification | ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T, Western Union, L/C, MoneyGram | Supply Ability | 10,000,000 Point /Day |
| Delivery Time | 1-7days | Packaging Details | ESD packaging with carton box |
| Product name | HDI PCB Board | Material | FR4, 94v0 Circuit Board |
| Copper thickness | 1OZ | Min. line spacing/width | 0.1＊0.1mm |
| Min. hole size | Laser 0.05mm ; Mechnical 0.15mm | Service | One-stop Service,PCB&PCBA,ODM and OEM |
| PCB Assembly method | Mixed, SMT, and THT | Board thickness | 1.6mm |
| DK | 3.6 | surface treatment | ENIG |
| Brand Name | HNL-PCBA | Model Number | PCB Assembly 08 |
| Certification | ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000 | Place of Origin | CHINA |
| High Light | 94v0 hdi pcb board ，4layer hdi pcb board ，oem fabricating hdi multilayer pcb | ||
The High-Density Interconnect (HDI) Printed Circuit Board is HDI PCB Board. There is little space between the PCB components, making the board space smaller, at the same time the board functionally isn’t affected. That is, a PCB with about 120 – 160 pins per square inch is an HDI PCB. All of the other electronic components are mounted on the printed circuit boards(PCBs),which are the foundation.
| FACTORY CAPABILITIES | |||
| No. | Items | 2020 | |
| 1 | HDI Capabilities | HDI ELIC(5+2+5) | |
| 2 | Max layer count | 46L | |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | |
| 4 | Min.Hole Size | Laser 0.05mm | |
| Mechnical 0.15mm | |||
| 5 | Min Line Width/Space | 0.030mm/0.030mm | |
| 6 | Copper Thickness | 1/3oz-6oz | |
| 7 | Size Max Panel size | 700x610mm | |
| 8 | Registration Accuracy | +/-0.05mm | |
| 9 | Routing Accuracy | +/-0.05mm | |
| 10 | Min.BGA PAD | 0.125mm | |
| 11 | Max Aspect Ratio | 10:01 | |
| 12 | Bow and Twist | 0.50% | |
| 13 | Impedance Control Tolerance | +/-5% | |
| 14 | Daily output | 4,000m2 (Max capacity of equipment) | |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
| PCBA Capability | |||
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Components | Chip&IC | 1005 | 55mm |
| BGA Pitch | 0.3mm | - | |
| QFP Pitch | 0.3mm | - | |
1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.
Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment
Similar products
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Company information
We have profuse experience in manufacturing PCB,owned experienced technical R & D technology team, young and professional sales and customer service team, experienced and professional procurement team and assembly testing team, which make sure the products quality of the pass rate, on-time delivery rate of customer orders.
Our services include: circuit board design and layout, 2-46 layers PCB manufacturing, professional FPC production, electronic components purchasing, SMT professional processing, Soldering and Assembly, especially sample and small bulk orders. we have the advantages of a quick quote, fast production, fast delivery.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2006
Total Annual:
600-1000
Employee Number:
200~300
Ecer Certification：
Active Member
ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ... ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ...
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