Microwave Molybdenum Copper Alloy Sheet Electronic Packaging Materials Packaging

Product Specification

Molybdenum and Copper For Use In Electronic Packaging Materials, Use Copper Alloy Sheet.

 
1. A Description Of Copper Alloy Sheet With Molybdenum For Use In Electronic Packaging Materials
 
Copper molybdenum copper sheet, also known as CMC material, is a metal-based plane layered composite electronic packaging material. Its core is made of pure molybdenum, and its exterior is either coated in pure copper or copper that has undergone dispersion strengthening. Because the middle of the copper molybdenum copper sheet is a molybdenum plate, and molybdenum has excellent strength, electrical conductivity, and thermal conductivity, so this type of material has good thermal conductivity and low expansion coefficient in the plane direction, and basically does not There are densification issues. The production process generally adopts rolling composite, electroplating composite, explosion forming and other methods to process and prepare. Compared with particle-enhanced electronic packaging materials produced by powder metallurgy methods such as Mo/Cu and W/Cu, the rolling composite method has high efficiency and low production cost in producing flat composite electronic packaging materials, and can produce large-sized packaging materials. Therefore, the flat composite electronic packaging material of copper-molybdenum-copper sheet is very beneficial to the production of the electronic industry, and it is easy to produce "scale benefits".
 
The thermal expansion coefficient of this material is adjustable, the thermal conductivity is high, and the high temperature resistance performance is excellent. The production process is generally prepared by rolling composite, electroplating composite, explosion forming and other methods. Mainly used as heat sinks, lead frames, and bottom expansion and thermal conduction paths for multi-layer printed circuit boards (PCBs).
 

 
2.Parameter of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging Materials:
 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
3. Feature of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging Materials:

1). Copper Molybdenum Copper Alloy Sheet is a composite material with a sandwich-like structure, the core material is molybdenum, and both sides are coated with copper. Its coefficient of expansion and thermal conductivity are designed for use in heat sinks, lead frames, low-expansion layers and thermal vias in multilayer printed circuit boards (PCBs). This material can be stamped.
2). Power electronics and circuits operate with considerable heat production.The heat sink material helps to dissipate heat from the chip, transfer it to other media, and maintain stable operation of the chip.
3). It has a thermal expansion coefficient and high thermal conductivity matching with different substrates; excellent high temperature stability and uniformity; excellent processing performance;
 
4. Application of Copper Molybdenum Copper Alloy Sheet For Electronic Packaging Materials:
1). Product use is similar to tungsten copper alloy.
2). Its expansion coefficient and thermal conductivity can be designed for RF, microwave and semiconductor high-power devices.
Copper Molybdenum Copper Alloy Sheet electronic packaging material has excellent thermal conductivity and adjustable thermal expansion coefficient. It is currently the preferred electronic packaging material for high-power electronic components at home and abroad, and can be matched with Be0 and Al203 ceramics. It is widely used in microwave, communication, radio frequency, aviation Aerospace, power electronics, high-power semiconductor lasers, medical and other industries. For example, the BGA package that is popular in the world now uses a large number of copper-molybdenum-copper sheets as the substrate. In addition, in the fields of microwave packaging and radio frequency packaging, this material is also widely used as heat sink. In military electronic equipment, copper-molybdenum-copper sheet is often used as the base material for high-reliability circuit boards.
 

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