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Huaswin Electronics Co.,Limited

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China 8 Layer Immersion Gold Flexible Printed Circuit Board Assembly FR4 Stiffener
China 8 Layer Immersion Gold Flexible Printed Circuit Board Assembly FR4 Stiffener

  1. China 8 Layer Immersion Gold Flexible Printed Circuit Board Assembly FR4 Stiffener

8 Layer Immersion Gold Flexible Printed Circuit Board Assembly FR4 Stiffener

  1. MOQ: 1 sets
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, Western Union, L/C
Supply Ability 10,000pcs per month
Delivery Time 15-20 working days
Packaging Details Anti-static bag + Anti-static bubble wrap + Good quality carton box
Brand Name HUASWIN
Model Number HSFPC1002
Certification ISO/UL/RoHS
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union, L/C Supply Ability 10,000pcs per month
Delivery Time 15-20 working days Packaging Details Anti-static bag + Anti-static bubble wrap + Good quality carton box
Brand Name HUASWIN Model Number HSFPC1002
Certification ISO/UL/RoHS Place of Origin China
High Light FPC BoardFlexible Printed Circuit Board

8 layer Immersion Gold Flexible PCB Assembly With FR4 Stiffener

 

 

Our PCB board manufacture and PCB assembly service

1. PCB board file with parts list provided by customers 
2. PCB board made, circuit board parts purchased by us 
3. High Quality, competitive Price & Best Service 
4.100% E-tested PCB 
 

Technical Capacity: 

Testing Procedures For PCB Board: 
---We perform multiple quality assuring procedures before shipping out any PCB board. These include: 
* Visual Inspection 
* Flying probe 
* Impedance control 
* Solder-ability detection 
* Digital metallograghic microscope 
* AOI (Automated Optical Inspection) 

Quotation Requirement: 

--- Following specifications are needed for quotation: 
A) Base material 
B) Board thickness 
C) Copper thickness 
D) Surface treatment 
E) color of solder mask and silkscreen 
F) Quantity 

Delivery Time for PCB board: 
1) PCB production time: Sample: 3-4 days / mass production: Within 7 days 
2) Component purchase: 2 days if all components is available in our domestic market. 
3) PCB Assembly: Samples: Whthin 2 days / mass production: Within 5 days 

Shipping Method and Payment terms: 

1. By DHL, UPS, FedEx, TNT using clients account. 
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder. 
3. By EMS (Usually for Russia Clients), price is high. 
4. By sea for mass quantity according to customer's requirement. 
5. By customer's Forwarder 
6. By Paypal, T/T, West Union, etc. 
 
 

Detailed Specification of Flexible PCB Manufacturing

 

Technical  Specification

Layers:

1~10 (flex Pcb)  and 2~8 (rigid flex)

 

Min Panel Size:

5mm x 8mm

 

Max Panel Size:

250 x 520mm

 

Min Finished board thickness:

0.05mm (1 sided inclusive copper)

 

Max Finished board thickness:

0.3mm (2 sided inclusive copper)

 

Finished board thickness tolerance:

±0.02~0.03mm

 

Material: 

Kapton, Polyimide, PET

 

Base copper thickness (RA or ED):

1/3 oz, 1/2 oz, 1oz, 2oz

 

Base PI thickness:

0.5mil, 0.7mil, 0.8mil, 1mil, 2mil

 

Stiffner:

Polyimide, PET, FR4, SUS

 

Min Finished hole diameter:

Φ 0.15mm

 

Max Finished hole diameter:

Φ 6.30mm

 

Finished hole diameter tolerance (PTH):

±2 mil ( ±0.050mm)

 

Finished hole diameter tolerance (NPTH):

±1 mil ( ±0.025mm)

 

Min width/spacing (1/3oz):

0.05mm/0.06mm

 

Min width/spacing (1/2oz):

0.06mm/0.07mm

 

Min width/spacing (1oz):

Single layer: 0.07mm/0.08mm

 

Double layer: 0.08mm/0.09mm

 

Aspect Ratio

6:01

8:01

Base Copper

1/3Oz--2Oz

3 Oz for Prototype

Size Tolerance

Conductor Width:±10%

W ≤0.5mm

Hole Size: ±0.05mm

H ≤1.5mm

Hole Registration: ±0.050mm

 

Outline Tolerance:±0.075mm

L ≤50mm

Surface Treatment

ENIG: 0.025um - 3um

 

OSP:

 

Immersion Tin: 0.04-1.5um

 

Dielectric Strength

AC500V

 

Solder Float

288℃/10s

IPC Standard

Peeling Strength

1.0kgf/cm

IPC-TM-650

Flammability

94V-O

UL

 

 

PCB Assembly services: 

 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 

Material Sourcing 
IC pre-programming / Burning on-line 

Function testing as requested 

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

 applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. 

When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 

plastics, casings and print & packaging material

 

Testing Methods

AOI Testing
· Checks for solder paste 
· Checks for components down to 0201" 
· Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
· BGAs 
· Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

 

 

Detailed Specification of Pcb Assembly

 

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials 

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days 

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2000

  • Employee Number:

    >500

  • Ecer Certification:

    Active Member

  Huaswin Electronics Co., Limited is a professional PCB and PCBA manufacturer founded in 2000 year.   We supply a comprehensive suit of one-stop manufacturing service: Bare PCB fabrication =>components sourcing =>Automatic SMT / through hole PCB ass...   Huaswin Electronics Co., Limited is a professional PCB and PCBA manufacturer founded in 2000 year.   We supply a comprehensive suit of one-stop manufacturing service: Bare PCB fabrication =>components sourcing =>Automatic SMT / through hole PCB ass...

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  • Huaswin Electronics Co.,Limited
  • http://www.printedboardassembly.com/

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