Blue Solder mask Pcb Prototype Assembly , Game SMT / DIP Assembly

Product Specification

Blue Solder mask Pcb Prototype Assembly , Game SMT / DIP Assembly

Blue Solder mask PCB Assembly Game Circuit Board Assembly SMT / DIP Assembly

PCBA boards for game equipment 

Specifications
 

 1. PCB Assembly on SMT and DIP

 2. PCB schematic drawing/ layout /producing

 3. PCBA clone/change board

 4. Components sourcing and purchasing for PCBA 

 5. Enclosure design and plastic injection molding

 6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing,  X-Ray For BGA Testing,         3D Paste Thickness Test

 7. IC programing

Quotation Requirement :

 
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
 
 

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities: 

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation

Detailed Specification of PCB Manufacturing
 

 
PCB Assembly services: 
 
SMT Assembly 

Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 

Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.

Complete box build

Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 

Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Quality Processes: 

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949