FR4 Tg170 Material Copper Circuit Board Assembly Bluetooth Electronics 1.6mm

Product Specification

Circuit Board Assembly FR4 Tg170 Material Copper 1OZ Rohs Bluetooth Electronics Applied With High Quality Best Services

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities:
Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation
 

FAQ
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.

Specifications
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 3D Paste Thickness Test
7. IC programing

Quotation Requirement :
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
 

 

 

 

 
Detailed Specification of PCB Manufacturing
 
 
PCB Assembly services: 
 
SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 
 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 
Quality Processes: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949