Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
No of layers: | 6 Layer |
Material: | FR4 TG>170 |
Impedance Control | 50 Ohm |
Solder mask colour: | Green |
Surface technics: | ENIG |
PCB Size | 106mm*91mm/6pcs |
Brand Name | WITGAIN PCB |
Model Number | Half hole PCB0014 |
Certification | UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
No of layers: | 6 Layer | Material: | FR4 TG>170 |
Impedance Control | 50 Ohm | Solder mask colour: | Green |
Surface technics: | ENIG | PCB Size | 106mm*91mm/6pcs |
Brand Name | WITGAIN PCB | Model Number | Half hole PCB0014 |
Certification | UL | Place of Origin | China |
High Light | 6 Layer Half Hole PCB ,TG170 Half Hole PCB ,Fr4 Printed Circuit Board |
6 Layer Half Hole PCB 0.8 MM Thickness S1000-2 Material TG170
Board Info:
1 Part NO: Half hole PCB0014
2 Layer Count: 6 Layer PCB
3 Finished Board Thickness: 0.8MM tolerance is +/-0.1MM
4 Copper Thickness: 1/1/1/1/1/1OZ
5 PCB Size: 106mm*91mm/6pcs
6 Application Area: Bluetooth Module
Our Capabilities:
NO | Item | Capability |
1 | Layer Count | 1-24 Layers |
2 | Board Thickness | 0.1mm-6.0mm |
3 | Finished Board Max Size | 700mm*800mm |
4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
5 | Warp | <0.7% |
6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc |
7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
8 | Drill Hole Diameter | 0.1mm-6.5mm |
9 | Out Layer Copper Thickness | 1/2OZ-8OZ |
10 | Inner Layer Copper Thickness | 1/3OZ-6OZ |
11 | Aspect Ratio | 10:1 |
12 | PTH Hole Tolerance | +/-3mil |
13 | NPTH Hole Tolerance | +/-1mil |
14 | Copper Thickness of PTH Wall | >10mil(25um) |
15 | Line Width And Space | 2/2mil |
16 | Min Solder Mask Bridge | 2.5mil |
17 | Solder Mask Alignment Tolerance | +/-2mil |
18 | Dimension Tolerance | +/-4mil |
19 | Max Gold Thickness | 200u'(0.2mil) |
20 | Thermal Shock | 288℃, 10s, 3 times |
21 | Impedance Control | +/-10% |
22 | Test Capability | PAD Size min 0.1mm |
23 | Min BGA | 7mil |
24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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