Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
No of layers: | 8 layers |
Solder Mask: | Red Solder Mask |
Min Hole Size | 0.2MM |
PCB Outline Size | 234.95mm*165.1mm/1pcs |
Impedance Control: | 50 ohm |
Min Lind Space&Width: | 4/4 mil |
Brand Name | WITGAIN PCB |
Model Number | Multi-Layer PCB0026 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
No of layers: | 8 layers | Solder Mask: | Red Solder Mask |
Min Hole Size | 0.2MM | PCB Outline Size | 234.95mm*165.1mm/1pcs |
Impedance Control: | 50 ohm | Min Lind Space&Width: | 4/4 mil |
Brand Name | WITGAIN PCB | Model Number | Multi-Layer PCB0026 |
Certification | UL | Place of Origin | China |
High Light | Printed Multilayer Circuit Board ,8 Layer Multilayer Circuit Board ,50 ohm solder printed circuit board |
Multi Layer Circuit Board 8 Layer Printed Circuit Board Red Solder Mask
PCB Specifications:
1 Part NO: Multi-Layer PCB0026
2 Layer Count: 8 Layer PCB
3 Finished Board Thickness: 2.0MM
4 Copper Thickness: 1/1/1/1/1/1 OZ
5 Min Lind Space&Width: 4/4 mil
6 Application Area: Industrial Control
Material Data Sheet:
S1130 | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 135 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 310 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 65 | |
After Tg | ppm/℃ | 310 | |||
50-260℃ | % | 4.5 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 13 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | <1 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 60S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 4.8E + 08 | |
E-24/125 | MΩ.cm | 4.6E + 06 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.2E + 07 | |
E-24/125 | MΩ | 5.3E + 06 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 120 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 60 | |
Electrical Strength | IPC-TM-650 2.5.6.2 | D-48/50+D-4/23 | kV/mm | — | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.6 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.016 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength(1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.8 | |||
125℃ | N/mm | 1.6 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
CW | IPC-TM-650 2.4.4 | A | MPa | 500 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 | |
CTI | IEC30112 | C-48/23/50, | ℃ | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Our Product Categories:
Our Product Categories | ||
Material Kinds | Layer Counts | Treatments |
FR4 | Single Layer | HASL Lead Free |
CEM-1 | 2 Layer/Double Layer | OSP |
CEM-3 | 4 Layer | Immersion Gold/ENIG |
Aluminum Substrate | 6 Layer | Hard Gold Plating |
Iron Substrate | 8 Layer | Immersion Silver |
PTFE | 10 Layer | Immersion Tin |
PI Polymide | 12 Layer | Gold fingers |
AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
Halogen free | 18 Layer | HDI Laser drilling |
Copper based | 20 Layer | Selective immersion gold |
22 Layer | immersion gold +OSP | |
24 Layer | Resin filled in vias |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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