Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 20mil PCB Frequency Circuit Board ，ENEPIG Frequency Circuit Board ，RO4730G3 Circuit Board | ||
Introducing our newly shipped PCB which based on RO4730G3 substrates. RO4730G3 by Rogers is a cutting-edge hydrocarbon/ceramic/woven glass UL 94 V-0 antenna grade laminate, designed to provide exceptional performance while offering a low-cost alternative to traditional PTFE-based laminates. With its advanced resin systems, RO4730G3 delivers the necessary properties required for ideal antenna performance, making it a go-to choice for designers seeking to optimize both cost and functionality.
Key Features of RO4730G3:
1. Impressive Electrical Properties:
- Dielectric Constant (Dk) of 3.0 +/- 0.05 at 10GHz: Ensures reliable signal transmission and reception.
- Dissipation Factor of 0.0028 at 10GHz: Results in low signal loss and reduced interference.
- Thermal Coefficient of Dk of 34 ppm/°C: Enables consistent performance across temperature variations.
- Coefficient of Thermal Expansion (CTE) matched to copper: Minimizes stress and ensures PCB integrity.
- Tg (Glass Transition Temperature) of >280 °C: Offers excellent thermal stability and reliability.
- Decomposition Temperature (Td) of 411 °C TGA: Ensures high-temperature resistance.
2. Benefits That Set RO4730G3 Apart:
- Low Loss Dielectric with Low Profile Foil:
* Reduced PIM (Passive Intermodulation)
* Low insertion loss for optimized signal integrity.
- Unique Filler/Closed Microspheres:
* Lightweight: 30% lighter than PTFE/Glass materials, enabling weight-optimized designs.
* Low density for enhanced performance.
- Low Z-Axis CTE (<30 ppm/°C) and High Tg (>280°C):
* Design flexibility and compatibility with automated assembly processes.
- Low TCDk (<40 ppm/°C):
* Consistent circuit performance under varying temperature conditions.
- Specially Formulated Thermoset Resin System/Filler:
* Ease of fabrication and PTH (Plated Through-Hole) process capability.
- Environmentally Friendly:
* Lead-free process compatibility and RoHS compliance.
3. PCB Construction Details:
- 2-layer rigid PCB with a copper layer thickness of 35 μm.
- RO4730G3 core thickness of 0.508 mm (20mil).
- Finished board thickness of 0.6mm.
- 1oz (1.4 mils) outer layer copper weight.
- Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish.
- Green solder mask on both top and bottom layers.
- No silkscreen for a clean and minimalistic look.
- Via plating thickness of 20 μm.
- Minimum trace/space of 4/6 mils.
- Minimum hole size of 0.25mm.
- 100% electrical testing conducted prior to shipment.
| RO4730G3 Typical Value | |||||
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
4. PCB Statistics:
- Components: 29
- Total Pads: 38
- Thru Hole Pads: 22
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 17
- Nets: 6
5. Quality Standard, Artwork, and Availability:
- Quality Standard: IPC-Class-2, ensuring high manufacturing standards.
- Artwork Supplied: Gerber RS-274-X, facilitating accurate reproduction.
- Availability: RO4730G3 is available worldwide, providing easy access for PCB manufacturers and designers.
| PCB Material: | Hydrocarbon ceramic woven glass |
| Designator: | RO4730G3 |
| Dielectric constant: | 3.0 ±0.05 (process) |
| 2.98 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| Laminate thickness(low profile copper): | 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
| Laminate thickness(ED Copper) | 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP,etc. |
6. Typical Applications:
- Cellular Base Station Antennas: RO4730G3's superior electrical properties make it an ideal choice for base station antennas, ensuring reliable communication in cellular networks.
In conclusion, Rogers RO4730G3 PCBs offer a reliable, cost-effective, and high-performance solution for antenna applications. With its exceptional electrical properties, design flexibility, and environmentally friendly features, RO4730G3 empowers designers to achieve optimal antenna performance while optimizing costs. Whether you're building cellular base station antennas or any other RF application, RO4730G3 is the go-to PCB material for superior results.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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