Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 20mil PCB Substrates ，PCB Board 1oz ，Ceramic Filled PTFE Composites PCB Substrates | ||
Introducing our newly shipped PCB, crafted with Rogers RT/duroid 6035HTC material, a cutting-edge substrate designed to deliver exceptional performance for your electronic designs. With its advanced features and reliable construction, this PCB unlocks new possibilities for a wide range of applications. Let's delve into the key specifications and benefits that make this PCB a game-changer for your projects.
PCB Substrates: Unparalleled Performance and Thermal Stability
The Rogers RT/duroid 6035HTC material is a ceramic-filled PTFE composite, known for its outstanding performance and thermal stability. With a dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C, this substrate provides excellent electrical efficiency, making it ideal for high-frequency applications. The low dissipation factor of 0.0013 at 10 GHz/23°C guarantees minimal signal loss, ensuring optimal signal integrity.
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
| Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
Thermal Management and Stability: Key Features for High-Power Applications
This PCB excels in thermal management with its high thermal conductivity of 1.44 W/m/K at 80°C. It efficiently dissipates heat, allowing for lower operating temperatures in high-power applications. The low loss tangent ensures excellent high-frequency performance, enabling your circuits to operate seamlessly. The thermally stable low-profile and reverse-treated copper foil contribute to lower insertion loss and excellent thermal stability of traces. The advanced filler system enhances drillability and extends tool life compared to alumina-containing circuit materials.
Precise Construction Details for Optimal Performance
The construction of this PCB features a 2-layer rigid design. It consists of copper layers with a thickness of 35 μm, enclosing the 0.508 mm (20mil) RT/duroid 6035HTC core. The board dimensions measure 150.2 mm x 66.5 mm, offering ample space for your designs. With a tolerance of +/- 0.15mm, precise manufacturing is ensured. The PCB supports a minimum trace/space of 7/7 mils and a minimum hole size of 0.5mm, accommodating intricate circuit layouts. The finished board thickness is 0.6mm, with 1oz (1.4 mils) outer layer copper weight and 20 μm via plating thickness, ensuring robust construction and reliable performance.
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Additional Specifications and Applications
This PCB boasts an immersion silver surface finish, providing excellent conductivity and corrosion resistance. It does not include silkscreen or solder mask, offering a clean and minimalistic appearance. Before shipment, the PCB undergoes 100% electrical testing to ensure the highest quality standards for your projects.
With worldwide availability, this PCB suits various industries and applications. Its exceptional performance makes it an ideal choice for high-frequency and high-power applications, such as RF and microwave amplifiers, power amplifiers, couplers, filters, and more. Embrace the future of advanced PCB technology with Rogers RT/duroid 6035HTC and elevate your designs to unprecedented levels of performance and reliability.
For any technical inquiries or to explore the possibilities of RT/duroid 6035HTC in your applications, please contact our dedicated sales team at sales10@bichengpcb.com. Experience the power of advanced PCB materials and take your projects to new heights of success.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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