Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB size | ≤400mm X 500mm |
| PCB thickness | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-148.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Ceramic, Hydrocarbon, Thermoset Polymer Composites | Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB size | ≤400mm X 500mm | PCB thickness | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m |
| Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG, OSP etc.. | Brand Name | Bicheng |
| Model Number | BIC-148.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | TMM10 Rogers PCB Board ，15mil Rogers PCB Board ，TMM10 Rogers Printed Circuit Board | ||
Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.
TMM10 laminates' electrical and mechanical characteristics combine many of the advantages of ceramic and conventional PTFE microwave circuit laminates without the need for the specific manufacturing processes typical of these materials.
The thermal coefficient of dielectric constant of TMM10 laminates is typically less than 30 ppm/°C, which is extremely low. The material can produce high reliability plated through holes with minimal etch shrinkage values thanks to its isotropic coefficients of thermal expansion, which are extremely closely matched to those of copper. Additionally, TMM10 laminates' thermal conductivity is about twice as high as that of conventional PTFE/ceramic laminates, making it easier to remove heat from the system.
The thermoset resins used in TMM10 laminates prevent them from softening when heated. As a result, there is no need to worry about pad lifting or other issues while wire bonding component leads to circuit traces.
Some Typical Applications:
1. Filters and coupler
2. Power amplifiers and combiners
3. RF and microwave circuitry
Our Capabilities (TMM10)
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM10 |
| Dielectric constant: | 9.20 ±0.23 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of TMM10
| TMM10 Typical Value | ||||||
| Property | TMM10 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 | |||||
| Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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