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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB
China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB

  1. China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB
  2. China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB
  3. China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB
  4. China TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material TU-883
Layer count 20 layers
PCB thickness 3.0mm
Solder mask Green
Silkscreen White
Surface finish Immersion gold
Brand Name Bicheng
Model Number BIC-509.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Material TU-883 Layer count 20 layers
PCB thickness 3.0mm Solder mask Green
Silkscreen White Surface finish Immersion gold
Brand Name Bicheng Model Number BIC-509.V1.0
Certification UL, ISO9001, IATF16949 Place of Origin CHINA
High Light Multilayer Impedance Controlled Pcb3.0mm Impedance Controlled Pcb20 Layers Impedance Controlled Pcb

 

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.

 

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

 

 

Detailed Specifications

Item Description Actual Result
1. Laminate Material Type TU-883 ACC
Tg 170℃ ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D ACC
Color Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask Material Type /  
Thickness /  
Location /  
6. Identification UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove Angle /  
Residual thickness /  
11. Beveling Angle /  
Height /  
12. Function Electrical Test 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5℃ ACC
Thermal Stress Test 288 ±5℃ ACC
Ionic Contamination Test 0.56µg/c㎡ ACC

 

Stackup & Impedance Controlled

 

HDI vias

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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