Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4535 0.762mm |
| Layer count | 2 layers |
| PCB thickness | 0.8 mm ±0.1 |
| PCB size | 75 x 170mm=1up |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-190.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4535 0.762mm | Layer count | 2 layers |
| PCB thickness | 0.8 mm ±0.1 | PCB size | 75 x 170mm=1up |
| Solder mask | Green | Silkscreen | White |
| Copper weight | 1oz | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-190.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
RO4535 High Frequency PCB Rogers 4535 30mil 0.762mm Antenna Circuit Board 2-Layer with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This is a type of antenna PCB made on Rogers RO4535 with 30mil substrate, starting 0.5oz copper, finished 1oz copper. Green solder mask is printed on top side and immersion gold plated on whole bottom layer. It is a double layer board manufactured as per IPC class 2 standard. All of the boards are 100% electrical tested, flying probe or test fixture, before shipment.
PCB Specifications
| PCB SIZE | 75 x 170mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| Rogers RO4535 0.762mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 3.0 mm |
| Number of Different Holes: | 8 |
| Number of Drill Holes: | 358 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4535 0.762mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.8 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 37.8% |
| Solder Mask Apply To: | Top side |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Component Side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Our Advantages
1. Powerful PCB capabilities support your research and development, sales and marketing;
2. PCB Products and Manufacturing are certified by authorized organizations;
3. 16000㎡ workshop with 30000㎡ output capability and 8000 types of PCB's per month;
4. Quick CADCAM checking and free PCB quotation;
5. No minimum order quantity. 1 piece is available;
6. A Team with passion, discipline, responsibility and honesty;
7. More than 19+ years of high frequency PCB experience;
8. Prototype PCB capability to Volume Production capability;
9. Delivery on time: >98%, Customer complaint rate: <1%
10. IPC Class 2 / IPC Class 3;
Our PCB Capabilities(2022)
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Appendix: Typical Value of RO4535
| Property | RO4535 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.44 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0037 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 17 | Y | ||||
| 50 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.9 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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