Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 |
| PCB thickness | 60mil |
| PCB size | 40 mm x 40 mm ± 0.15 mm |
| Layer count | 2-layer |
| Copper weight | 1OZ |
| Surface finish | Immersion Silver |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 | PCB thickness | 60mil |
| PCB size | 40 mm x 40 mm ± 0.15 mm | Layer count | 2-layer |
| Copper weight | 1OZ | Surface finish | Immersion Silver |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 2-Layer Immersion Silver Circuits PCB ，60mil Immersion Silver Circuits PCB ，Immersion Silver Circuits PCB 2 layer | ||
We are pleased to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-10 copper clad laminates. Engineered for high-frequency applications, RF-10 combines ceramic-filled PTFE and woven fiberglass to deliver a cost-effective substrate with exceptional electrical and thermal performance.
Key Features
The RF-10 material boasts a dielectric constant of 10.2 ± 0.3 at 10 GHz and a low dissipation factor of 0.0025, making it ideal for RF circuit size reduction. Its high thermal conductivity of 0.85 W/mK ensures effective thermal management, while its tight dimensional tolerances enhance stability in multilayer circuits. The material is also resistant to moisture (0.08% absorption) and has a flammability rating of V-0, ensuring safety and reliability.
| RF-10 Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | V-0 | V-0 | ||
PCB Specifications
This PCB features a well-structured stackup, consisting of:
- Copper Layer 1: 35 μm (1 oz)
- RF-10 Core: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm (1 oz)
The overall dimensions of this PCB are 40 mm x 40 mm ± 0.15 mm, with a finished thickness of 1.6 mm. The PCB supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.4 mm. It includes 1 oz finished copper weight on both outer layers and a via plating thickness of 20 μm.
For surface finish, it utilizes immersion silver, complemented by a black solder mask on the top side. A white silkscreen is applied for clear labeling, while the bottom side remains without a silkscreen or solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure high quality and performance.
| PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass |
| Designation: | RF-10 |
| Dielectric constant: | 10.2 |
| Dissipation Factor | 0.0025 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications
This versatile PCB is suitable for a variety of applications, including:
- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite Components
Quality Assurance and Availability
It meets IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with standard PCB design processes.
With RF-10, you gain a reliable and high-performance PCB solution tailored for your advanced RF applications.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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