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SHANGHAI FAMOUS TRADE CO.,LTD

  • China,Shanghai ,Shanghai
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China Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding
China Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding

  1. China Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding
  2. China Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding
  3. China Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding

Fully Automatic Wafer Thinning Machine Si SiC GaN ultra-thin wafer grinding

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Wafer Size Ø2" to Ø12"
Thinning Range 20μm - 800μm
Spindle Speed 500 - 6000 rpm
Cooling System Water + Air Cooling
Power Supply AC 380V ±10%, 50/60Hz, 3-phase
Weight Approx. 1500 kg
Brand Name ZMSH
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Wafer Size Ø2" to Ø12" Thinning Range 20μm - 800μm
Spindle Speed 500 - 6000 rpm Cooling System Water + Air Cooling
Power Supply AC 380V ±10%, 50/60Hz, 3-phase Weight Approx. 1500 kg
Brand Name ZMSH Place of Origin China

 

Product Introduction

The wafer thinning machine is a critical tool in semiconductor fabrication, designed to reduce wafer thickness through precise back grinding and polishing. This wafer thinning machine ensures high uniformity and surface quality, making it suitable for materials such as silicon, GaAs, GaN, and SiC. It plays an essential role in applications like power devices, MEMS, and CMOS image sensors.

 

Working Principle

The wafer thinning machine operates by securing the wafer and engaging it with a high-speed rotating grinding wheel. This wafer thinning machine incorporates advanced control systems to monitor grinding pressure and thickness in real time, ensuring stable and reliable thinning. Integrated cooling and cleaning mechanisms improve processing yield and minimize damage.

 

Wafer Thinning Machine Specification

 

Parameter Specification Remarks
Wafer Size Ø2" to Ø12" (Optional: Ø8" and above) Supports up to 300mm
Thinning Range 50μm - 800μm Minimum possible thickness: 20μm (depends on material)
Thickness Accuracy ±1μm With optional in-line thickness measurement
Surface Roughness <5nm Ra (after fine grinding) Depends on material and wheel type
Grinding Wheel Type Diamond Cup Wheel Replaceable
Spindle Speed 500 - 6000 rpm Stepless speed control
Vacuum Chuck Supported Porous ceramic vacuum chuck
Cooling System Water + Air Cooling Prevents thermal damage
Operation Mode Touchscreen with PLC Control Parameters adjustable and programmable
Optional Features Auto loading/unloading, thickness monitor, CCD alignment Customizable
Power Supply AC 380V ±10%, 50/60Hz, 3-phase Custom voltage options available
Machine Dimensions Approx. 1800mm × 1500mm × 1800mm May vary slightly by model
Weight Approx. 1500 kg Without auto-handling system
 

 

 

Applications

The wafer thinning machine is widely used in various semiconductor manufacturing processes where ultra-thin wafers are required, such as 3D IC packaging, power device fabrication, image sensors, and RF chips. The wafer thinning machine is often paired with post-thinning processes like backside metallization to provide a complete thinning solution.

In addition, the wafer thinning machine is applicable in the following scenarios:

  • Advanced Packaging: Including FO-WLP, 2.5D, and 3D packaging, where thinner wafers enable higher integration and shorter interconnects.

  • MEMS Device Fabrication: Wafer thinning improves sensor sensitivity by releasing the structural layer.

  • Power Semiconductor Devices: Materials like SiC and GaN require wafer thinning to reduce conduction loss and improve heat dissipation.

  • LiDAR Chips: Wafer thinning supports better optical alignment and electrical performance.

  • R&D and Academia: Universities and research institutions use the wafer thinning machine to explore semiconductor structures and verify new materials.

 

Q&A

Q1:What materials can be processed by this wafer thinning machine?
A1:Our wafer thinning machine is compatible with a wide range of materials, including silicon (Si), silicon carbide (SiC), gallium nitride (GaN), sapphire, gallium arsenide (GaAs), and more.

 

Q2: How does this wafer thinning machine ensure uniform thickness?
A2: It uses a precision grinding head with real-time thickness monitoring and adaptive control systems to maintain consistent thinning results.

 

Q3: What is the thickness range of this wafer thinning machine?
A3: Wafers can be thinned to 50μm or even thinner, depending on the material and application requirements.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Agent,Importer,Exporter,Trading Company

  • Year Established:

    2013

  • Total Annual:

    1000000-1500000

  • Ecer Certification:

    Verified Supplier

SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op...

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Get in touch with us

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  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Rm5-616,NO.851,Dianshanhu road; Qingpu area;shanghai city//201799
  • https://www.sapphire-substrate.com/

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